Search
What are you looking for?
Please try our search function!
en Select your language
en Search
Search
This new device widens DELO's existing portfolio of dispensing valves. While the closely related DELO-DOT PN5, introduced in 2022, was developed for more viscous, highly filled materials, the new LV (low-viscosity) variant is primarily aimed at dispensing smaller droplet sizes of low-to-medium-viscosity media with up to 35,000 mPa·s. Interchangeable nozzles with different diameters and a flexible, adjustable plunger stroke ensure precise…
Building on its 2024 feasibility study , which proved adhesives capable of reliably establishing electrical and mechanical miniLED connections, DELO has now examined their durability over extended test periods. Using stamping to dispense precise adhesive volumes onto structured test boards, single and arrayed miniLEDs were cured with a thermode process at 180 °C. The connections were then subjected to extended storage tests of up to 500…
The new adhesive was specially designed for the glass-on-die assembly method. The glass filter is fixed directly onto the chip, as is typical with iBGA image sensor packaging. Compared to previous products, DELO DUALBOND EG6290 has a significantly higher Young's modulus of 2,350 MPa and significantly higher adhesion value. Due to a glass transition temperature (Tg) of over +130 °C, the adhesive exhibits mechanically consistent…
To ensure optimal performance of the camera system, first lens bonding is used to join lens packages accurately, improving optical power and compensating for thermal stress between modules of varying sizes. DELO DUALBOND SJ4758 and DELO PHOTOBOND FB4176 are two products recognized for their excellent adhesion in narrow bonding gaps, and effective stress-relief characteristics. DELO DUALBOND SJ4758 offers rapid light fixation followed by a…
Both warpage and die shift are typical side effects of fan-out wafer-level packaging, a cost-efficient method in the semiconductor industry where numerous dies are encapsulated together on a carrier. Even though fan-out techniques on wafer- and panel-level constantly get refined, these issues associated with the involved compression molding remain. Warpage occurs due to chemical shrinkage when the liquid compression mold compound (LCM)…
What is new about the so-called activation on the flow is that the adhesive is already irradiated during the dispensing process, which starts the curing reaction even before the adhesive meets the component. After the combined process step, the components can be joined. Another special feature of the technology is that the exposed adhesive areas can be additionally irradiated and fixed after joining. This provides immediate initial…
The core of the new system is a special dispensing unit that can be equipped with up to three different dispensing valves. Depending on the properties of the pressure media and the structures to be dispensed, users can choose from a variety of established dispensing valves, such as jet valves, time-pressure valves, or screw dispensing systems. Each valve sits on a separate vertical axis. Since the dispensing heads can be operated in…
In bonding, along with manufacturing as a whole, there are many equally important factors, including output, quality, and sustainability. However, none of these things can be achieved without profitability. Achieving each of these factors requires a deep understanding of the bonding process, from basic knowledge to emerging innovations. Experts at the DELO Academy can help provide this understanding in this year’s series of webinars. TECH…
Attendees of the virtual conference, entitled "AR and VR: Your Path to The Future," will learn how novel AR and VR technologies can be brought to market, what innovations are made possible by optical materials, and what manufacturing trends are currently emerging. Presentations will be given by market research company, IDTechEX; semiconductor manufacturing expert, EVG; active alignment market leader, Kasalis; European pilot line for the…
SUSS MicroTec, leading supplier of equipment and process solutions for the semiconductor industry, announces the cooperation with DELO, a leading manufacturer of high-tech adhesives and other multifunctional materials. The central focus of the cooperation is the development and qualification of enhanced process solutions for micro-imprint lithography applications, especially the interaction of equipment and materials. The use of imprint…
Advanced driver assistance systems (ADAS) have been a defining technological marvel in the automotive industry since the turn of the century. Beginning with features such as RADAR-guided cruise control, these technologies have evolved to enable some autonomous driving functions, allowing for greater safety and, more recently, reduced driver intervention. Adhesives have been crucial for ADAS, especially given the latter’s rising market…
The UV-curing adhesive’s transparent characteristics make it hardly distinguishable from the lens material. Its yellowing resistance is higher than similar products, retaining its transparency even after a typical 500-hour storage period at +140 °C. This is important for bonding increasingly powerful LED modules that generate more heat. The acrylic adhesive works with a variety of materials found in a headlight, where it has…
Primary highlights of the DELOLUX 30 curing lamp include ahigherpeak intensity of up to 22.5 W/cm² as well as increased homogeneity in its intensity distribution. What this results in is quicker fixation and a more consistent final bond, increasing production efficiency and yield, as well as product quality in real-world use cases. The cylindrical lamp head measures at 80 mm tall with a diameter of 30 mm, connecting with a highly flexible…
Enabled by compressed air, the pneumatic retraction valve features many properties which promote a high level of repeatability and help ensure a quality bond. Heightened precision and control come from its retraction mechanism. Following dispensing, rather than simply ceasing air compression, the needle “retracts,” pulling back slightly to reverse the flow of adhesive. This, in turn, creates a vacuum effect, curtailing adhesive flow…
The halogen- and solvent-free acrylate allows for extremely fine microstructure designs—so-called micro dams—in semiconductor packaging and on printed circuit boards. With it, bondlines with widths of less than 100 µm in an aspect ratio of five or more can be dispensed. Previously, achieving line widths of even 200 µm was considered a challenge. This new micro dam solution was developed in close partnership with NSW Automation, a systems…
