In some applications, it is not possible to cure the adhesives by mere exposure to light. Therefore, dual curing mechanisms are highly beneficial, especially when bonding components with large shadowed areas. It combines the opportunities of light curing with reliable curing in shadowed areas by an additional curing mechanism, for example by heat or humidity.
DELO®-DUALBOND®
DELO®-DUALBOND®
DELO®-DUALBOND® adhesives bond touch panel elements of smartphones. Materials frequently found in this field are glass covers or plastic substrates in combination with black print. They are temperature-sensitive and opaque so that the adhesive used must cure at room temperature.
Cavities are often found when casting pins, connectors or microswitches. Uncured adhesive may penetrate the components through them and may cause corrosion at electrical contacts. Combined light and humidity curing can prevent this.
Display applications often require adhesives that also cure under opaque black print. DELO®-DUALBOND® makes this possible thanks to combined light and humidity curing.
Properties
- Good resistance to thermal shock stress
- Fast and reliable light curing in shadowed areas
- Universal adhesion to many substrates
- Optimized flow behavior for sealing and casting
- Versions range from flexible to hard
- Optically transparent adhesives available for large-area bonding
Application areas
Further application areas
Electronics | Mobile phone
Contact
DELO Industrial Adhesives LLC
144 North Road Suite 2650
Sudbury, MA 01776
978 254 5275
978 610 6129
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