Therefore, DELO has developed DAM&FILL® encapsulants. The heat-curing adhesives are optically intransparent, provide a very high degree of mechanical protection, and are easy to process on existing encapsulation systems. DELO's DAM&FILL® compounds are absolutely opaque even in thin layers.
Advantages overview of black Dam&Fill® compounds:
- Enables short cycle times
- High mechanical stress values compared to conventional UV-curing encapsulants
- Easy to integrate into existing encapsulation systems