DELO Industrial Adhesives, Mühlbauer and Impinj, Inc. (NASDAQ: PI), have announced a new milestone in the effort to achieve high-volume inlay manufacturing. The three RAIN RFID industry leaders have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.
DELO has developed an encapsulant with very high resistance to media and temperature. Thanks to an optimized curing time, DELO MONOPOX GE6515 also accelerates production processes. The product is particularly well suited for encapsulating electronic components in automotive applications.
Fillers in adhesives, potting compounds and encapsulants can lead to mechanical abrasion in dispensing systems. Despite such potentially abrasive behavior, the adhesives can be dispensed reliably and precisely over the long term. This is the result of experimental tests performed by ViscoTec and DELO Industrial Adhesives, covering more than 6 million dispensing cycles.
DELO has published its new webinar program. After addressing basic topics, such as adhesive-friendly design, last year, the Webinars in 2019 will focus on areas such as structural bonding and e-mobility.
Demand for commercial aircraft is booming worldwide. The new flame-retardant structural adhesive, DELO-DUOPOX AB8162, makes production faster.
DELO has developed a new adhesive that achieves up to three times the strength of its predecessor products at high temperatures. DELO MONOPOX HT2860 can also be inductively cured, which significantly accelerates manufacturing processes. Among other applications, the epoxy resin is used in electric motors.