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Adhesives for advanced packaging: Optimize the power of your semiconductor chips and SMD assemblies with DELO
High-performance semiconductor chips are at the heart of modern technologies. They are indispensable in forward-looking areas such as artificial intelligence, autonomous driving, smart cities and robotics. Progress in miniaturization and improvements in component functionality depend heavily on the specifically optimized properties of the materials like the semiconductor adhesives used.
DELO specializes in the development of adhesives for semiconductor packaging. Our functional materials are suitable for a wide range of applications such as die attach, reinforcement (capillary underfill, corner fill, edge bond), the protection of semiconductor chips and CMOS image sensors with potting compounds or materials, for example, for glass lid bonding.
Our materials enable efficient, CO2-reduced production processes and are optimally suitable for fully automated series production.
Thanks to the special properties of DELO's semiconductor adhesives, you can increase the performance of your semiconductor packages. At the same time, our high-tech solutions create new possibilities in the field of heterogeneous integration and thus make a significant contribution to the further miniaturization.
Innovative semiconductor adhesives for every challenge in microelectronic packaging
Improve the reliability of your assemblies with our new adhesives and materials for the reinforcement of soldered contacts. We offer tailor-made solutions that support various methods for optimizing and securing connection stability. Rely on our expertise to ensure high performance over the lifetime of your semiconductor chips and other electronics.
Special potting compounds are used to ensure the long-term functional capability of semiconductor chips. DELO offers a wide range of innovative semiconductor adhesives for dam & fill and glob top applications as well as materials to reliably protect wire bonds.
Component Encapsulation Wire Encapsulation Large-area Encapsulation
Effective protection is crucial for the reliability of semiconductor packages such as CMOS image sensors or CPUs and GPUs. DELO offers innovative semiconductor adhesive for the demanding requirements of bonding filter glasses and heatspreaders, which guarantee a secure and durable bond.
Optical transceivers and, in particular, PICs (photonic integrated circuits) play an important role in the processing of increasing amounts of data. Our adhesives are tailored to the high optical and mechanical requirements and help to ensure that the huge amounts of data in data centers can be processed in the future using just light.
Micro dams can be used in semiconductor packaging as flow stops or ultra-fine optical barriers in the manufacture of optical sensors. With the materials developed by DELO, line widths of up to 50 µm can be realized. DELO semiconductor adhesives are a response to the increasing demand for high-performance components and create new possibilities in the field of heterogeneous integration and optical packaging.
What makes our products
DELO offers a plethora of products for various requirements. Our adhesives in particular are a real alternative to mechanical bonding. They cover a wide range of applications, from microelectronics to renewable energy. Whatever yours may be, we have the solutions you are looking for!
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
Adhesive solutions
DELO is your partner in various sectors. Our products are used in applications across semiconductors, automotive, consumer electronics, medical technology, aerospace, and many other sectors. We understand that every industry has its unique challenges and offer tailored adhesive solutions that increase both efficiency and performance. With DELO, you benefit from expertise that optimizes your production processes and makes your products competitive.
