- High strength after aging
- Precise dispensing
- Suitable for long-term use
- Thixotropy index of ~ 9
- Drop sizes down to below 250 µm can be achieved
- Curing takes place in 10 minutes at +130 °C
Suited for long-term use
DELO MONOPOX EG2596 can be used on printed circuit boards to fix components, and act as electrical insulation. It is temperature-resistant and offers good dispensing properties, meeting the increasing miniaturization requirements in today’s electronics.
Suited for long-term use, this new, heat-curing, one-component epoxy resin adhesive exhibits a 150% higher strength after seven days of storage at 85% relative air humidity and a temperature of +85 °C. DELO MONOPOX EG2596 maintains strong adhesion even after typical aging tests, like the MSL1 test, in accordance with JEDEC standard. When using 1x1 mm² silicon dies, the test revealed adhesion values of 47 N on FR4 substrate and 62 N on gold.
Excellent flow-resistant dispensing pattern
DELO MONOPOX EG2596 has a high thixotropy index of ~ 9. The higher the index value, the more flow-resistant the dispensing pattern will be after the dispensing process. The thixotropic properties of this die attach adhesive ensures that it can be applied very finely in a low-viscous state because of the shear in the dispensing valve.
After dispensing, viscosity increases again in fractions of a second, preventing the resin from flowing. This allows the adhesive to be built up in individual droplets and then shaped in a controlled manner, without it spreading into areas that should remain adhesive-free. Even during heat curing, the adhesive drop remains dimensionally stable.
The flow properties of DELO MONOPOX EG2596 are designed to allow dispensing by jet valves and needles. Thanks to this flexibility, the adhesive provides versatile application options. Tests conducted jointly by DELO and its technology partner, ASM Assembly Systems, show the excellent dispensing properties of the die attach adhesive using, among other dispensing systems, the ’Glue Feeder’. This jet valve allows the adhesive to be dispensed contactless and upside down. The adhesive is applied directly to the specific component and not to the printed circuit board. This solution ensures fast and highly precise processes.
Depending on the dispensing equipment, drop sizes down to below 250 µm can be achieved. Even after several shots, dispensing patterns remain uniform and do not show typical unwanted effects, like satellite droplets.
Curing takes place in 10 minutes at +130 °C. The fluorescent adhesive is available in 10 cc cartridges and can be ordered in quantities of just one. Once opened, the product can be processed in a user-friendly manner for up to seven days in a standard climate of +23 °C.