DELO, one of the world’s leading manufacturers of industrial adhesives for automotive, consumer and industrial electronics applications, introduces an electronic adhesive that is easy-to-handle and ideal for use on high separating walls between sensors that have little space width and chip encapsulation. DELOMONOPOX GE7985 is designed for automotive and industrial applications where high reliability is required in combination with miniaturized designs.
This new adhesive has smaller fillers than other products in DELO’s ‘dam-and-fill’ product range, allowing it to be applied with needles as small as 250 µm. The adhesive’s extremely high viscosity of 160,000 mPas provides a high flow resistance and an aspect ratio of 2.5, allowing the height of the adhesive bead to be more than twice its width without collapsing when dispensed.
This adhesive also allows for dam stacking, the stacking of bead layers around chips in order to protect them, without having to cure between layers.
DELOMONOPOX GE7985 ensures high reliability, low water absorption as well as resistance to acids, oils and other aggressive media. It has an extended service temperature range up to 200°C.
This black, one-component adhesive has a coefficient of thermal expansion (CTE) of 24 ppm/K and a high glass transition temperature of 180°C. This combination reduces warping over a large temperature range, minimizing stress on the package.
DELOMONOPOX GE7985 offers good strength properties on FR4 PCB where compression shear strength reaches 49 MPa. It cures under heat with variable conditions in terms of time and temperature.
- Can be applied with needles as small as 250 µm
- Extremely high viscosity of 160,000 mPas
- Extended service temperature range up to 200°C
- Coefficient of thermal expansion (CTE) of 24 ppm/K
- High glass transition temperature of 180°C