Die Attach
What is Die Attach?
Die attach is an adhesive process where semiconductor chips (dies) are applied to substrates or leadframes using special adhesives. This process is crucial for the reliability and performance of semiconductor components and requires highest precision and material quality.
Properties of Die Attach Adhesives
- High thermal conductivity for efficient heat dissipation
- Low shrinkage to avoid stress
- Excellent adhesion on various substrates
- Fast initial strength for efficient manufacturing
- Long-term stability at operating temperatures
- Electrical insulation or conductivity depending on requirements
Applications
- Semiconductor production: CPU, GPU and memory chips
- Power electronics: IGBT and MOSFET modules
- LED manufacturing: High-power LEDs and COB arrays
- Automotive electronics: Sensors and control units
Substrate Materials
- Ceramics: Aluminum oxide and aluminum nitride
- Metals: Copper and aluminum leadframes
- Organic substrates: BT resin and polyimide
- Glass: For optical and MEMS applications
Processing Parameters
- Precise dispensing in microliter range
- Controlled flash-off time before chip placement
- Defined curing cycles for optimal properties
- Process temperatures between 80°C and 200°C
DELO Adhesive Solutions
- Thermally conductive and electrically insulating systems
- Electrically conductive adhesives for special applications
- Activis technology for precise process control
Looking for die attach adhesives for your semiconductor production?
