PEEK Bonding

Properties of PEEK as a Substrate

• Very low surface energy complicates wetting
• High chemical resistance to solvents and acids
• Temperature resistance up to 250°C continuous
• Excellent mechanical strength and stiffness
• Biocompatibility for medical applications
• Electrical insulation properties

Surface Preparation

• Plasma treatment: Surface activation for better wetting
• Sandblasting: Mechanical roughening of bonding surface
• Chemical etching: Surface modification with sulfuric acid
• Primer systems: Adhesion promoters for PEEK surfaces
• UV/ozone treatment: Photooxidative activation

Suitable Adhesive Systems

• Structural adhesives: High strength for load-bearing bonds
• Epoxy resins: Excellent adhesion after pretreatment
• High Temperature Adhesives: For thermally stressed applications
• UV-curing systems: Fast curing for series production

Applications

• Medical Technology: Implants and surgical instruments
• Aerospace: Lightweight structures and housings
• Medical Electronics: Biocompatible electronics housings
• Automotive industry: High-temperature components in engine compartment

Challenges in PEEK Bonding

• Low surface energy: Special pretreatment required
• Thermal expansion: Adaptation of bond line
• Chemical resistance: Adhesive must show same resistance
• Shelf life of adhesive for optimal processability

Test Methods

• Contact angle measurement: Wettability of PEEK surface
• Tensile shear testing: Strength of adhesive bond
• Aging tests: Long-term resistance
• Climate change tests: Temperature and humidity resistance