White paper
DSC Encapsulation for AI and HPC Packaging
How UV-curing materials and precise jet dispensing enable reliable DSC protection in modern 2.5D packages
As AI and HPC applications demand ever-higher chip performance, die-side capacitors (DSCs) have become critical components for stable power delivery in advanced 2.5D packages. Placed directly alongside the processor die, DSCs minimize parasitic inductance and suppress voltage fluctuations — yet their protection poses one of the most demanding challenges in modern semiconductor packaging. Tight keep-out zones, the risk of resin bleed-out, and the need for contamination-free, high-throughput processing make conventional encapsulation materials insufficient.
DELO has developed a UV-curable encapsulant specifically engineered for DSC protection in LGA-, BGA-, and PGA-based packages. Its precisely balanced thixotropic formulation ensures complete, void-free coverage without resin bleed-out, while 10–60-second UV curing eliminates thermal stress, reduces cycle times, and significantly lowers energy consumption and CO₂ emissions compared to conventional thermal curing.
What can you expect in this white paper?
- Material design insights: How the thixotropic formulation with 16,000 mPa·s viscosity and a thixotropic index of 5 achieves the critical balance between flowability and shape retention
- Process details: How precision jet dispensing via DELO-DOT PN5 with a 75 µm nozzle enables contamination-free, flexible application across different DSC form factors and package designs
- Reliability test results: Performance data from uHAST, MSL1 qualification, and five reflow cycles at +260°C — with zero degradation in adhesion or encapsulation integrity
- Mechanical compliance data: How an elongation at tear of 90%, a Young’s modulus of 10 MPa, and a glass transition temperature of –40°C ensure long-term stability under thermal cycling
- Implementation guidance: Step-by-step integration into existing production lines and key considerations for KOZ compliance, substrate compatibility, and BGA reflow exposure
Why adhesive solutions from DELO?
- Deep advanced packaging expertise: Decades of experience in semiconductor assembly materials, with dedicated solutions for DSC encapsulation, underfill, stiffener attach, and edge coating
- Proven reliability under extreme conditions: Validated performance across temperature cycle testing (–55°C to +125°C / 1,000 cycles), uHAST, MSL1, and multiple reflow exposures
- Integrated system approach: UV-curable encapsulants combined with matching DELO dispensing and curing equipment — engineered as a complete, production-ready workflow
- Sustainable and scalable manufacturing: Fast UV curing significantly reduces energy consumption and CO₂ emissions, supporting both high-volume throughput and sustainability goals
Your advantages at a glance
- Complete coverage: Thixotropic flow behavior ensures full encapsulation of DSC edges and undercuts — with zero resin bleed-out into keep-out zones
- Long-term reliability: Mechanically compliant formulation withstands repeated thermal cycling without cracking or delamination
- Fast, low-stress curing: UV polymerization in 10–60 seconds eliminates thermal stress on solder joints, die interfaces, and substrate materials
- Flexible production integration: Software-defined jet dispensing adapts to different DSC sizes, layouts, and package designs without hardware changes
- Reduced environmental impact: UV curing significantly lowers energy consumption and CO₂ emissions compared to conventional thermal curing processes
Let us inspire you!
Discover how DELO’s UV-curable encapsulation technology sets new standards in reliability, process efficiency, and sustainability for DSC protection in AI and HPC packaging. Download the white paper now and get a comprehensive picture of material design, application process, and validated reliability results.
Download the white paper now and learn more!
About DELO
DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.
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