White paper
5 Major Challenges in Image Sensor Packaging and How You Solve Them
Proven solutions meeting AEC-Q100 requirements
Automotive image sensors are the digital eyes of modern vehicles – enabling ADAS functions, autonomous driving, and critical safety systems. Yet they must withstand extreme operating conditions, from -55°C to +125°C, mechanical vibrations, humidity, and chemical exposure, over vehicle lifespans exceeding 15 years. Traditional bonding solutions often fail these demands, exhibiting delamination, outgassing, and flow deficiencies that compromise system reliability.
Discover how DELO’s advanced adhesive solutions help automotive image sensors meet the most stringent qualification standards, including AEC-Q100 Grade 2 and MSL 3 – while addressing ongoing miniaturization and cost pressures. From hermetic lid attach to void-free wire encapsulation, DELO provides proven, automotive-grade solutions from a single source.
What can you expect in this white paper?
- Hermetic sealing & pressure management: How flexible, high-performance adhesives prevent pop-up effects, cracks, and tilt misalignments in filter glass bonding
- Thermal stress & CTE mismatch: Advanced encapsulants with optimized filler systems achieving CTE values below 20 ppm/K for long-term reliability under extreme thermal cycling
- Fine-pitch processing: Low-viscosity encapsulants enabling void-free filling of wire bond pitches below 50 µm
- Warpage reduction: Low-temperature curing from +90°C reduces substrate warpage by up to 80% compared to conventional materials
- Outgassing & bleed-out control: Specially developed formulations that protect sensitive optical surfaces and ensure long-term image quality
- Integrated process solutions: Adhesive materials, dispensing equipment, and UV curing systems – all from a single source for maximum process stability
Why adhesive solutions from DELO?
- More than 60 years of expertise in high-performance adhesives for semiconductor, automotive, and optoelectronics applications
- Proven AEC-Q100 Grade 2 qualification, validated through 1,000 temperature cycles from -55°C to +125°C
- Complete process solutions from a single source: adhesives, dispensing equipment, and UV curing systems developed and optimized in-house
- Trusted by global industry leaders including Bosch, Mercedes-Benz, and Sony for mission-critical automotive applications
Your advantages at a glance
- Reliable sealing: Airtight filter glass bonding that withstands pressure variations and extreme temperature cycling throughout the vehicle lifespan
- Thermal stability: Encapsulants with Tg exceeding 150°C and CTE below 20 ppm/K minimize thermal stress and prevent delamination
- Precision at the smallest scale: Void-free encapsulation of wire bond pitches below 50 µm for next-generation miniaturized sensor packages
- Reduced warpage: Low-temperature curing reduces substrate warpage by up to 80%, simplifying downstream assembly operations
- Optical integrity: Controlled outgassing and bleed-out properties protect sensitive image sensor surfaces for consistent, long-term image quality
Let us inspire you!
Discover how DELO’s advanced adhesive technology solves the five most critical challenges in automotive image sensor sealing – from hermetic lid attach to fine-pitch wire encapsulation. Get proven solutions that meet AEC-Q100 requirements and support the reliability demands of next-generation ADAS and autonomous driving systems.
Download the white paper now and learn more!
About DELO
DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.
Industry Leaders Trust DELO
