Whitepaper
Creating Space with Micro Dams
Optimizing Semiconductor Packaging
Discover in our free whitepaper how innovative Micro Dams help overcome spatial constraints in semiconductor packaging. These innovations enhance process security, reduce production costs, and offer tailored solutions for your needs.
Micro Dam: A Contribution to Miniaturization
Discover how micro dam technology offers more space for innovation in semiconductor packaging by exploring our free whitepaper! It's all about:
- Overcoming spatial constraints: An innovative approach to furhter advance heterogenious integration.
- Miniaturization technologies: Microstructures are essential for semiconductor fabrication, serving as flow barriers and optical separators.
- Production adaptation: Learn about transitioning from lab processes to mass production.
- Advanced microstructures: DELO's technologies enable stacking and prevent material leakage, vital for precise applications.
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