Electronic Potting Compound Temperature Resistant
What is Temperature Resistant Electronic Potting Compound?
Temperature resistant electronic potting compound is a potting compound specially developed for permanent protection of electronic assemblies at elevated operating temperatures. It reliably protects components against moisture, chemicals, and mechanical stress, even under continuous thermal load.
Properties of Temperature Resistant Electronic Potting Compounds
- Continuous operating temperatures of up to 200 °C and higher
- Stable dielectric properties across the entire temperature range
- Low thermal expansion to minimize mechanical stresses
- Chemical resistance to coolants, oils, and operating fluids
- Long-term aging resistance under continuous thermal stress
- Low initial viscosity for complete wetting of complex geometries
Applications
- Automotive: Potting of engine control units and power modules in the engine compartment
- Electric motor manufacturing: Protection of frequency converters and control electronics
- Power electronics: Inverters, DC/DC converters, and onboard chargers for electric vehicles
- Semiconductor technology: Potting of high-performance chips and power modules
- Aerospace: Protection of electronic assemblies under extreme temperature conditions
Curing Systems
- Heat curing: Controlled thermal crosslinking for high final strengths
- UV pre-curing with thermal post-curing for geometrically complex assemblies
- 1-component systems: Simple processing without mixing errors
- Dual cartridges: Precise 2K processing with defined mixing ratios
DELO Electronic Potting Compounds
- Temperature-resistant potting compounds for operating temperatures up to 250 °C
- High temperature potting compound for particularly demanding thermal requirements
- Customized formulations with adapted viscosity and thermal conductivity
Looking for temperature resistant potting compounds for electronics applications?
