High Temperature Potting Compund
What is High Temperature Potting Compound?
High temperature potting compound is a potting compound specially developed for permanent protection of electronic assemblies at elevated operating temperatures. These materials provide reliable protection from thermal, mechanical, and chemical influences in demanding high-temperature environments.
Properties of High Temperature Potting Compounds
- Continuous operating temperatures up to 200°C and higher
- Low thermal expansion for stress minimization
- Excellent thermal conductivity
- Chemical resistance to aggressive media
- Long-term aging resistance at high temperatures
- Low viscosity for complete wetting
Applications
- Semiconductor Packages: Potting of power semiconductors
- Electric Motor Adhesive: Protection of motor electronics
- Power electronics: Inverters and frequency converters
- Aerospace: Electronics under extreme conditions
Curing Systems
- Thermal curing: Controlled crosslinking at elevated temperature
- Moisture Curing Systems: Curing at ambient temperature
- UV pre-curing with thermal post-curing
- 1-Component Systems for easy processing
Material Requirements
- Glass transition temperature well above operating temperature
- Minimal outgassing at high temperatures
- High dielectric strength
- Resistance to thermal cycles
Processing Techniques
- Dispensing Valves: Precise automated application
- Vacuum potting: Bubble-free wetting of complex geometries
- Jet Valve: Contactless dispensing of smallest quantities
- Dip potting: Complete encapsulation of assemblies
DELO Adhesive Solutions
- Temperature-resistant formulations up to 250°C
- Various viscosities for optimal processability
- Special additives for increased thermal conductivity
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