Semiconductor Packages
What are Semiconductor Packages?
Semiconductor packages are protective housings for semiconductor chips that provide mechanical, thermal, and electrical protection while enabling electrical contact to the outside. These packages are crucial for the reliability and longevity of electronic components.
Properties of Semiconductor Packages
- Mechanical protection from external influences
- Heat dissipation from semiconductor chip
- Electrical insulation and contacting
- Hermetic sealing against moisture
- Various designs for different applications
- Material diversity from ceramic to plastic
Package Types
- Die Attach packages: Direct chip mounting
- BGA (Ball Grid Array): High connection density
- QFP (Quad Flat Package): Surface mounting
- TO packages: Power semiconductors with heat sink connection
Bonding Applications
- Lid bonding: Hermetic closure of packages
- Glob Top: Additional chip protection in open packages
- Thermal pads: Thermal coupling to heat sinks
- High Temperature Adhesives: For power applications
Material Compatibility
- Ceramic packages: High temperature resistance and hermeticity
- Plastic packages: Cost-effective for standard applications
- Metal packages: Excellent heat dissipation
- Hybrid packages: Combination of different materials
Quality Requirements
- Aging resistance over product lifetime
- Gas tightness for sensitive semiconductors
- Thermal cycle resistance
- Electrical isolation and EMC compatibility
DELO Adhesive Solution
- High Temperature Potting Compound for power semiconductors
- Hermetic sealing systems
- Special formulations for various package materials
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