Vacuum Potting
What is Vacuum Potting?
Vacuum potting is a potting process in which potting compounds are introduced into electronic assemblies under vacuum conditions. The reduced air pressure prevents air inclusions and bubble formation, enabling complete, bubble-free wetting of even complex component geometries.
Properties of Vacuum Potting
- Complete bubble-freedom through controlled air pressure reduction
- Gap-free wetting of complex cavities and geometries
- Improved thermal and electrical insulation properties
- Higher mechanical strength through homogeneous potting layer
- Reproducible quality in industrial series production
- Suitable for low- and medium-viscosity potting compounds
Applications
- Power electronics: Bubble-free potting of inverters and DC/DC converters
- Automotive: Protection of control units and sensor modules
- Transformer and coil manufacturing: Complete impregnation of windings
- Semiconductor technology: Hermetic sealing of housings
- Medical technology: Protection of sensitive electronic assemblies
Processing Guidelines
- Vacuum pressure: Typically 1–50 mbar depending on material viscosity and component geometry
- Degas potting compound before application to remove entrapped air
- Carefully observe pot life for reactive 2K systems
- Dispense using precise dispensing valves or volumetric systems
- After potting, perform controlled pressure equalization to prevent drawback
DELO Adhesive Solutions
- Vacuum potting-compatible compounds for power and automotive electronics
- 1-component systems for simplified process control
- Technical consulting for process design and material selection for vacuum potting applications
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