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Fan-out packaging has long been understood as a cost-efficient packaging method in the semiconductor industry. However, it requires maximum precision, and is not without its challenges: Warpage and die shift, caused by the use of traditional thermosetting materials.
DELO has developed a pioneering solution: UV-curing molding compounds. These not only minimize warpage and die shift, but also considerablyreduce energy consumption and curing time. Our feasibility study confirms the advantages over conventional heat-curing processes.
Warpage is caused by chemical shrinkage of the mold compound either during curing or cooling after heat curing. The different coefficients of thermal expansion (CTE) of silicon chips, the molding compound and carrier substrate lead to warpage of the entire assembly.
Die shift results from the molding compound being highly filled and therefore pasty, and can therefore only be processed with heat and high pressure. As the chips are temporarily bonded to the substrates, this bonding can soften due to heat. This causes dies to shift under the pressure required to press the molding material.
DELO's process starts with a temporary adhesive on the carrier wafer and test chips positioned face-down on the wafer. Instead of the usual high-viscosity, heat-curing material, we use a low-viscosity, UV-curing DELO material. Our studies prove this: Cooling after heat curing causes warpage, which is significantly reduced with our method. UV light at room temperature minimizes the effect of the different CTEs of the molding compound and carrier material, thus minimizing the warpage of the wafer.
Figure 6: Monolithic wafer DELO KATIOBOND OM614 with nano-grating structure (Figure: DELO)
Our feasibility study shows that temperatures between curing and further processing do not play a role thanks to UV-curing at room temperature. This effectively reduces both warpage and die shift. Our tests with a model adhesive achieved impressive results: Aviscosity of 35,000 mPa-s and a Young’s modulus of 1 GPa. Compared to the usual 800,000 mPa-s and double-digit GPa values of conventional materials, our method almost eliminates die shift.
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With UV-curing potting compounds, DELO offers a future-oriented solution for the challenges of fan-out wafer-level packaging. You benefit from reduced warpage, avoided die shift and lower energy consumption. Our innovation paves the way for more efficient and resource-saving production processes in the semiconductor industry.
Interested in more information about our UV-curing potting compounds? Take advantage of our free project consultation!
DELO is a leading provider of high-tech adhesives, offering solutions for semiconductor, automotive and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies like Bosch, Huawei, and Siemens trust DELO for superior adhesive technologies.
We are your touchpoint for high-tech bonding. Our specialist worldwide are keen to support you. Get in touch with us now!
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