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Read more about the development and demonstration of a new expanded-beam connector module for use in photonic integrated circuits (PICs). The goal is to enable efficient, repeatable, and robust connections between optical fibers and photonic chips that meet the growing demands of data communication and integration.
Advantages:
Potential:
Particularly valuable for high-density data centers and photonics technology applications, such as PIC and Co-Packaged Optics (CPO)
This article demonstrates that single-mode expanded-beam connectors represent a viable solution for precise yet robust fiber-to-PIC coupling. This technology could significantly facilitate the mass production and integration of photonic systems.
DELO has been a leading manufacturer of high-tech adhesives and multifunctional materials for more than 60 years. Along with our state-of-the-art dispensing and curing equipment, our advanced adhesives are essential in the semiconductor, automotive, and consumer electronics industries. You can find them in almost every smartphone and in every other car — used in everything from cameras and loudspeakers to electric motors and sensors — powering many of the innovations that shape our daily lives.
Headquartered in Germany, DELO operates globally with subsidiaries in China, Japan, Malaysia, Singapore, and the USA, supported by an extensive network of distributors. 1,200 employees contribute every day to developing innovative, high-quality products while supporting and inspiring our customers worldwide. Global leaders such as Bosch, Huawei, Mercedes-Benz, Osram, Siemens, and Sony trust DELO for first-class solutions. This ongoing success fuels our drive to continue advancing the world of high-tech adhesives.
