A green microchip with golden circuitry, partially covered by a transparent pink adhesive layer. The "DELO" logo is visible on the chip. This image illustrates the concept of encapsulation using adhesive in microelectronics.

DELO News

Bonding | Feb 28, 2019

High-temperature Resistant Encapsulant for Electronics

DELO has developed an innovative encapsulant, the DELO MONOPOX GE6515, which is characterized by high media and temperature resistance. This encapsulant optimizes manufacturing processes through a shortened curing time and is particularly suitable for use in the automotive industry.

DELO MONOPOX GE6515 is a one-component, purely heat-curing epoxy resin that delivers impressive strength even at high temperatures. At 150°C, it achieves a strength of 20 MPa on aluminum and maintains a strength of 14 MPa even at 200°C. The product also adheres very well to materials such as FR4, PA, and copper, and has been specifically developed for the encapsulation of electronic components. Additionally, the adhesive exhibits high resistance to chemicals such as oils, acids, and fuels.

Additionally, DELO MONOPOX GE6515 offers a coefficient of thermal expansion (CTE) tailored to the automotive sector. This CTE is 23 ppm/K up to the glass transition temperature (Tg) of 155°C and 48 ppm/K above Tg. A low CTE is particularly advantageous when minimizing thermal distortion is crucial.

Curing takes place in a convection oven at temperature between +90°C and +150°C. At 130°C, the epoxy resin is completely cured in just 15 minutes, enabling accelerated manufacturing processes. The extended working time of one week also provides additional flexibility during application—a significant advantage over the 48 hours typical of conventional products.

A green microchip with golden circuitry, partially covered by a transparent pink adhesive layer. The "DELO" logo is visible on the chip. This image illustrates the concept of encapsulation using adhesive in microelectronics.

Encapsulation of microelectronic components with DELO adhesives, visualized in pink.

Advantages of DELO MONOPOX GE6515

  • High media and temperature resistance: The encapsulant remains firm and stable even at high temperatures up to 200°C
  • Fast curing: At 130°C, the epoxy resin fully cures within 15 minutes, allowing for accelerated manufacturing processes
  • Versatile adhesion: The product adheres well to materials such as aluminum, FR4, PA, and copper, making it particularly versatile
  • Chemical resistance: Withstands aggressive substances like oils, acids, and fuels, making it ideal for automotive applications
  • Low coefficient of thermal expansion: Minimizes deformation during temperature fluctuations
  • Extended working time: A working time of one week allows for flexible processes during application

Conclusion

DELO MONOPOX GE6515 is an advanced encapsulant ideally suited for demanding applications in the electronics and automotive sectors. With its resistance to high temperatures and chemicals, combined with fast curing and extended working time, it meets the requirements of modern manufacturing processes. Companies that value efficiency and durability will find a reliable solution in this product.

Are you interested in benefiting from advanced adhesive solutions? Contact our team of experts to learn in a no-obligation consultation how DELO products can optimally meet your individual requirements!

About DELO

DELO is a leading provider of high-tech adhesives. For over 25 years, we have been offering solutions for the automotive, electronics, and semiconductor industries. Our innovative technologies set industry benchmarks. Companies like Bosch, Huawei, and Siemens trust DELO for superior adhesive technologies.

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