Specialized adhesives enable precision bonding of miniaturized laser components in seconds
Laser technology is the industrial manufacturing method of the future. It enables higher precision and faster production rates through more efficient processes with reduced material and resource consumption. Laser system manufacturers face a central challenge: How can increasingly smaller optical components be reliably and precisely mounted in high-performance laser systems? The progressive miniaturization of laser optics requires micrometer-precise positioning of components such as Fast Axis Collimator lenses (FAC), Slow Axis Collimators (SAC), mirrors, and prisms, while simultaneously maintaining the highest quality standards. Even the smallest deviations significantly impair laser performance.
Laser Technology
Traditional mechanical connections reach their limits when assembling miniaturized laser components. Specialized high-tech adhesives offer an alternative joining method for various laser components due to the following advantages.
Laser applications already enable new production processes today and have the potential to develop into a universal tool. With the epoxy adhesives of the DELO KATIOBOND family, DELO has now developed specialized adhesives that are excellently suited for laser system manufacturers. These dual-curing systems combine light and heat curing. Thanks to activation-on-the-flow technology, the adhesive can be pre-activated during application and subsequently cures within just one to five seconds. The adhesives demonstrate exceptional laser resistance, controllable shrinkage, and minimal outgassing – critical factors for micrometer-precise positioning in Active Alignment processes. Through ultra-fast curing, they can be processed quickly, which shortens cycle times in production. This reduces manufacturing times by up to 80 percent while maintaining the highest quality and makes laser technology more economical.
In addition to component bonding, DELO addresses the critical housing sealing of laser systems. While traditional O-rings and rubber seals can fail under extreme temperatures and aggressive environments, adhesive sealing offers significantly higher resistance. The DELO PHOTOBOND family delivers tailored solutions as liquid gaskets, suitable for both Cured in Place Gasket (CIPG) applications and Formed in Place Gasket (FIPG) processes. This liquid gasket optimally adapts to complex geometries of laser housings and ensures long-term sealing under extreme operating conditions.
DELO's innovative adhesive solutions enable laser system manufacturers to tap into new application fields from the automotive industry to medical technology, increase competitiveness through shorter production cycles, and ensure reliable systems with extended service life.
Cross-section of a pump semiconductor laser system, adhesive colored magenta for illustration purposes
Sealing of a of a pump semiconductor laser system, adhesive colored magenta for illustration purposes
Get in touch with our experts
If you would like more information about DELO KATIOBOND adhesives, DELO PHOTOBOND liquid gaskets and our specialized bonding solutions for laser applications, please feel free to contact us. Our technical experts will support you in planning your laser assembly projects efficiently and implementing them successfully.
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DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.