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Electronic components are the unsung heroes of the technologies we use. From automobiles to consumer goods and industrial electronics, they have to withstand enormous loads. High temperatures, strong vibrations, chemicals—the list goes on. Conventional potting methods for their protection often create air bubbles that impair the service life and reliability of these components. Air bubbles in wire windings or under printed circuit boards can lead to stresses under load. In the worst-case scenario, chemicals can penetrate and damage the component.
The solution for this problem is vacuum potting. This method effectively prevents the formation of air bubbles during potting process. DELO regularly conducts trials with long-term partners such as Scheugenpflug to illustrate of the advantages of this method. Read on to learn about bubble-free potting compounds for your PCBs (or other components) and how, with this system, they can better hold up under pressure
In many applications, especially where service life and reliability are crucial, there often is no alternative to vacuum potting. Whether it be sensors in engine control systems such as exhaust gas sensors, or components that are used in hot transmission oil, vacuum potting is the solution for these and more applications for the following reasons:
The path to bubble-free electronics is less complicated than it may initially sound. Vacuum potting works through a controlled reduction in pressure. You don't need an absolute vacuum, just a reduction to around 1 mbar to effectively remove air. The technology is flexible and can be adapted to different geometries and materials without compromising on component safety.
Innovative devices such as the LeadVDS system from Scheugenpflug simplify this process. These systems are compact, ideal for research, development, and small-series production.
To show skeptics the difference between vacuum and atmospheric pressure potting, DELO and Scheugenpflug carried out a test with standard components. A standard printed circuit board in a conventional PBT plastic housing was used, and a low-viscosity, two-component epoxy resin for the high-reliability range was used as the potting compound to simulate an application in the automotive sector. This product is permanently temperature-resistant up to +200 °C, resistant to diesel, petrol or oil, and protects engine and exhaust gas control sensors, for example, in practice.
For potting tests under atmospheric pressure, the two components were mixed and dispensed manually. During the test run under vacuum, the potting compound was also degassed and then dispensed. The LeanVDS from Scheugenpflug, an entry-level system for vacuum potting, was used to simulate a laboratory-scale test.
DELO and Scheugenpflug decided to use X-ray images to analyze the results. In contrast to micrographs, this method is not only non-destructive, but there is also no risk of separating the component at a bubble-free point and thus overlooking possible bubbles at other points.
If you look at the X-ray images of either component, you will see clear differences. While the above printed circuit board was vacuum-potted without bubbles, a large bubble had formed on the below printed circuit board potted under atmospheric pressure.
As a result, depending on the application and operating environment, the component may fail—oftentimes only after mere months—if you opt for atmospheric potting.
At DELO, technical superiority and efficiency begin with well thought-out solutions to avoid air bubbles during potting.
The introduction of vacuum potting is changing the way components are produced and protected. The method not only offers short-term benefits, but also strengthens the performance and longevity of your components.
Rely on DELO to take your electronics to the next level.
Interested in our vacuum potting technology? Check our events page to find our next trade fair or take advantage of our non-binding project consultation.
DELO is a leading provider of high-tech adhesives, offering solutions for automotive, electronics, and semiconductor industries for over 25 years. Our innovative technologies set industry standards. Companies like Bosch, Huawei, and Siemens trust DELO for superior adhesive technologies.
We are your touchpoint for high-tech bonding. Our specialist worldwide are keen to support you. Get in touch with us now!
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