To ensure your safety behind the wheel, autonomous driving technologies come with especially strict requirements. Therefore, reliable components such as image sensors are used in LiDAR and RADAR systems. Sensor housings on PCBs must be hermetically sealed throughout their entire service life in order to maintain their function permanently without interruption. However, existing solutions for hermetically sealing the housing and filter glass are reaching their limits due to these stricter requirements, failing to withstand the tests of the automotive industry, according to standard AEC-Q100.

With DELO DUALBOND BS3770, there is now a special electronics adhesive that semiconductor manufacturers can use to meet automotive suppliers’ demanding reliability and qualification tests.

Unlike other adhesives available on the market, this adhesive has properties that enable a particular level of flexibility and durability.

These include:

• A Young’s modulus of less than 5 MPa at room temperature
• Can maintain its flexibility in temperatures as cold as -50 °C
• Is able to withstand sudden pressure changes that result from changes in temperature, humidity, or heat input during reflow processes