Device Packaging Conference
Place / hall: 24
Description:
Fountain Hills, AZ | USA
The IMAPS International Conference & Exhibition on Device Packaging is a major forum for the exchange of knowledge in the field of microelectronics, with numerous technical demonstrations and networking opportunities throughout the event, attracting attendees in both industry and academia. DELO is proud to be a corporate sponsor of this event.
We will be showcasing our adhesive and dispensing process solutions for advanced packaging systems such as Fan-Out packaging in more complex multi-chip setups. Also to be demonstrated are our solutions for photonic IC (PIC) packaging, including optical coupling, fiber packaging, cladding, and OE attach.
In addition to technical innovations, DELO focuses on sustainable solutions that can reduce both the use of materials and CO2 emissions. These will also be presented at the conference.
And make sure to join us at our presentation, UV for Fan-Out: Taking warpage out of the equation, on March 19th, 2024 at 04.00 pm to hear more from our experts. We hope to see you there!