Dates

Coiltech Germany 2025

Place / hall: 3-A07

Description:

Augsburg | Germany

Coilech is one of the most important events in the coil winding industry, occurring each year in Pordenone, Italy and Augsburg, Germany. This exhibition is entering its 3^rd year in Augsburg on March 20 and 21, 2024 with hundreds of exhibitors expected to be present – developers as well as manufactures and maintainers of electric motors, transformers, and generators.

DELO will present the latest developments in adhesives for electric motor applications, where coil windings also play a significant role. Find us at booth 5-B15 and talk to our experts about your bonding challenges.

Want to know more about the exhibition?
Find out here

Productronica China 2025

Place / hall: Hall W1 / Booth 1600

Description:

Shanghai New International Expo Centre | China

Productronica China is one of the leading platforms for innovative electronics development and production. The forums highlight current market trends and technologies.

DELO presents the latest developments in industrial adhesives and corresponding dispensing and curing technology for the semiconductor industry, the automotive industry and consumer electronics. Among other things, we will present our hightech reinforcement materials for edge bond and corner fill applications as well as solutions for closed cavity packaing.

Stop by our booth 1600 and talk to our experts about your bonding challenges.

SEMICON Southeast Asia 2025

Place / hall: B2625

Description:

20 - 22 May 2025 | Sands Expo and Convention Centre (Singapore)
Semicon area

SEMICON Southeast Asia is the leading event for electronics manufacturing in Southeast Asia, bringing together professionals from across the electronics industry. In 2025, this prestigious event will celebrate its 30th anniversary. Take the opportunity to engage with experts from over 500 local and international companies at more than 1,000 exhibition booths.

If you're interested in the latest innovations in the semiconductor sector, such as new adhesive and process solutions for enhanced solder joints, we warmly invite you to visit our booth. There we will showcase furthermore our state-of-the-art dispensing devices and curing lamps.

We look forward to welcoming you and having insightful conversations with you! Learn more about SEMICON Southeast Asia now.

Enmore Automotive Conference 2025

Place / hall: 8-061

Description:

4 - 6 June 2025 | Hangzhou (China)
Automotive area

The Enmore Automotive Conference (EAC) is one of China’s largest gatherings of professionals working in the automotive industry, from OEMs to infotainment developers, to audio companies and sensor manufacturers.

DELO will be presenting innovative, light-fixable adhesives for the active alignment of optics in automotive cameras as well as high-tech materials for the chip-on-board process, in which image sensors are bonded and protected on printed circuit boards.

We look forward to your visit and to exchanging ideas with you! Find out more about the EAC now.

CWIEME Shanghai 2025

Description:

CWIEME is the world's largest exhibition for coil windings, transformers, generators, electric motors and e-mobility. The exhibition, which is a global hub for the industry, turns 28 this year. Over 600 exhibitors and more than 6,700 visitors are expected.

DELO will present the latest developments in the field of e-motors, ESC inverters and sensors. At the same time, the jetting process of balancing compounds will be demonstrated.

EMAX Malaysia 2025

Place / hall: A59

Description:

23 - 25 July 2025 | Penang (Malaysia)
Electronics Manufacturing area

The Electronics Manufacturing Expo Asia in Penang (Malaysia) is a meeting place for electronics manufacturing and assembly technology professionals from all over Asia. From 23 to 25 July, interested parties will have the opportunity to exchange ideas with chip and semiconductor manufacturers, meet equipment suppliers and find out about the latest developments in the electronics sector.

Visit DELO at booth A59 to discover suitable adhesive solutions, as well as state-of-the-art dispensing devices and curing lamps for your semiconductor applications.

Want to find out more? Learn more about EMAX Malaysia now.

European Microelectronics & Packaging Conference 2025

Place / hall: 47

Description:

Grenoble | FR

The 25th European Microelectronics & Packaging Conference (EMPC) lets you dive deep into the latest developments in all facets of the semiconductor industry. New materials for electronic packaging and potential system applications will be showcased by leading companies as well as academic institutions.

DELO will be presenting its high-tech reinforcement materials that help increase the durability and ruggedness of their applied components, as well as its latest solution for lid attach. Thanks to their airtight seal, DELO materials help provide sensors with the utmost protection.

Join our presentation about ”Adhesive Solutions for Closed Cavity Packaging" and talk to our experts! We are happy to seeing you!

Medtec China 2025

Description:

With over 1000 exhibitors from 27 countries, Medtec Shanghai is one of the leading trade fairs for medical device manufacturing. The fair attracts more than 80,000 visitors, including medical device manufacturers, engineers and decision makers, who come to learn about the latest developments and innovations in medical devices.

MicroLED Connect 2025

Place / hall: 1

Description:

24 - 25 September 2025 | Eindhoven (Netherlands)
MicroLED area

MicroLED Connect brings together researchers, developers and manufacturers from the industry to discuss the latest developments and challenges for MicroLED applications. The conference is taking place in Europe for the first time this year and promises dynamic exhibitions and masterclasses from the leading experts.

Do you have your own Micro LED applications and would like advice on your options and solutions? Visit DELO at MicroLED Connect in Eindhoven (Netherlands) on 25 and 26 September and exchange ideas with our specialists.

Want to find out more? Learn more about MicroLED Connect now.
 

Basic Seminar "Basics of bonding technology"

Description:

At DELO in Windach

More information

Basic Seminar "Surface pretreatment"

Description:

At DELO in Windach

More Information

Basic Seminar "Fast processes"

Description:

At DELO in Windach

Further information