Dates

Photonics West 2025

Place / hall: 3239

Description:

28 - 30 January 2025 | Moscone Center San Francisco, California (USA)
Optics and photonics area

SPIE Photonics West Exhibition 2025, the globally recognized event for suppliers of the best solutions, components, instruments and system support for the optics and photonics industry.

Optical materials and adhesives play a key role in the development of wafer-level optics for cameras, sensors or LEDs. Visit our booth at the SPIE Photonics West Exhibition and discover our latest adhesive trends for the optics and photonics industry. Exchange ideas with our experts directly on site and learn which DELO materials are particularly suitable for micro-optics and nanostructures.

We look forward to seeing you! Learn more about SPIE Photonics West now.

MD&M West 2025

Place / hall: 4046

Description:

04 - 06 February 2025 | Anaheim Convention Center, Anaheim, CA (USA)
Manufacturing area

MD&M West is an essential event that brings together leaders and innovators in the advanced manufacturing and medical device industries. Join industry experts, visionaries, and suppliers who are shaping the future of medical technology and smart manufacturing under one unified banner and co-locatet wit the ATX West, D&M West, Plastec West, and WestPack.

DELO will be presenting its Activation on the Flow technology. This technology streamlines processes by integrating two steps into one, offering precise dispensing and efficient adhesive preactivation. We will also be presenting our newest solutions in medical technology and other innovative process solutions.

Are you interested in discovering the latest advancements in manufacturing and medical technology? Visit us at MD&M West and explore how we can help push the boundaries of innovation.

Wafer-Level Packaging Symposium

Place / hall: Booth 10

Description:

San Francisco, CA | USA

The Wafer-Level Packaging Symposium hosted by SMTA, an international association of electronics engineers, is anticipated to be one of the largest gatherings of industry experts and thought leaders in the United States, with a focus on advanced packaging and adapting it to the age of AI.

DELO will be present to demonstrate its reliable UV-curing encapsulation materials for fan-out wafer-level packaging. Talk to our experts at the symposium and we can discuss possible target applications.

We are looking forward to seeing you at the Wafer-Level Packaging Symposium!

LOPEC 2025

Place / hall: B0.516

Description:

25 - 27 February 2025 | Messe München (Germany)
Flexible Electronics Area

LOPEC (Large-area, Organic & Printed Electronics Convention) is the world's leading trade fair and the most important congress for flexible, organic and printed electronics.

DELO presents itself at LOPEC as a solution provider for flexible electronics. Our focus is on innovative, conductive adhesives for flexible and molded electronics as well as on modern dispensing equipment. With these advanced solutions, we aim to drive the development of groundbreaking electronic applications. Visit us at LOPEC and discover DELO's conductive adhesives.

We look forward to your visit and to exchanging ideas with you! Find out more about LOPEC now.

Device Packaging Conference

Place / hall: 600

Description:

Phoenix, AZ | USA 

The IMAPS International Conference & Exhibition on Device Packaging is a major forum for the exchange of knowledge in the field of microelectronics, with numerous technical demonstrations and networking opportunities throughout the event, attracting attendees in both industry and academia. DELO is proud to be a corporate sponsor of this event.

We will be showcasing our adhesive and dispensing process solutions for advanced packaging systems such as Fan-Out packaging in more complex multi-chip setups. Also to be demonstrated are our solutions for photonic IC (PIC) packaging, including optical coupling, fiber packaging, cladding, and OE attach.

In addition to technical innovations, DELO focuses on sustainable solutions that can reduce both the use of materials and CO2 emissions. These will also be presented at the conference.

And make sure to join us at our presentation, „Micro dam structures - How to utilize them in advanced semiconductor packaging and verify correct application inline“. We hope to see you there!

Coiltech Germany 2024

Place / hall: 3-A07

Description:

Augsburg | Germany

Coilech is one of the most important events in the coil winding industry, occurring each year in Pordenone, Italy and Augsburg, Germany. This exhibition is entering its 3^rd year in Augsburg on March 20 and 21, 2024 with hundreds of exhibitors expected to be present – developers as well as manufactures and maintainers of electric motors, transformers, and generators.

DELO will present the latest developments in adhesives for electric motor applications, where coil windings also play a significant role. Find us at booth 5-B15 and talk to our experts about your bonding challenges.

Want to know more about the exhibition?
Find out here

Productronica China 2024

Place / hall: Hall E6 / Booth 6635

Description:

Shanghai New International Expo Centre | China

Productronica China is one of the leading platforms for innovative electronics development and production. The forums highlight current market trends and technologies.

DELO presents the latest developments in industrial adhesives and corresponding dispensing and curing technology for the semiconductor industry, the automotive industry and consumer electronics. Among other things, we will present our hightech reinforcement materials for edge bond and corner fill applications as well as solutions for closed cavity packaing.

Stop by our booth 1600 and talk to our experts about your bonding challenges.