Schematic illustration showing the process of miniLED integration on a PCB.

DELO News

News | Sep 10, 2025

Adhesives instead of soldering: DELO demonstrates potential for mini and microLED displays

Adhesives are increasingly proving to be an alternative to soldering in display manufacturing. DELO has once again demonstrated this in extensive long-term tests with directional (anisotropic conductive) adhesives. The results underscore the potential of adhesives for the scalable series production of miniLEDs and future microLED displays.

Schematic illustration showing the process of miniLED integration on a PCB.

Schematic illustration showing the process of miniLED integration on a PCB: before placement, after placement, and with the LED illuminated through adhesive connection

Feasibility study proves reliability

Advancing miniaturization is increasingly pushing conventional joining methods to their performance limits. That is why DELO's feasibility study, published in 2024 garnered significant interest among experts. At that time, DELO had shown that adhesives are in principle suitable for reliable electrical and mechanical miniLED connections. The adhesives not only perform a fixing function but also are directionally conductive to ensure the functionality of the MiniLEDs. In a now expanded study, these results were confirmed over significantly longer test periods— an important step toward the series maturity of modern miniLED and microLED displays.

Displays require long-term stability under extreme conditions

The study focused on investigating the long-term stability of adhesive bonds under extreme conditions. From a long-term perspective, the electrical and thermal conductivity of the bonds are particularly important. Conductivity is crucial for the durability and performance of components in displays

Infobox: Electrical (anisotropic) conductivity

Electrical conductivity in adhesives is made possible by conductive fillers (e.g., silver particles). In anisotropically conductive adhesives, the current flows in only one direction (perpendicular to the surface). This is ideal for the finest contact structures of miniLED and microLED chips and prevents short circuits between adjacent, closely spaced contacts.

To test the long-term quality of the bonds, defined amounts of adhesive were first applied to test boards using a stamping process, and the miniLEDs were then cured at 180 °C using a thermode. The connections created in this way had to withstand extreme conditions for over 500 hours, including continuous heat of 120 °C and 85 °C and 85% relative humidity. This combination simulates the stresses of real-world application scenarios and places high demands on electrical and mechanical stability.

The evaluation included:

  • Light tests to check optical stability
  • U/I measurements to check electrical conductivity
  • Shear strength tests to assess mechanical stability

The anisotropically conductive adhesive bonds also passed a particularly demanding test that combined heat and moisture exposure. Since heat and moisture usually place heavy demands on soldered joints in particular, the results demonstrate high long-term thermal conductivity and robustness. 
 

Infobox: Thermal conductivity

Thermal conductivity is essential for the reliability and efficiency of modern displays. An adhesive with high thermal conductivity efficiently dissipates the heat generated in a tiny area from the LED chips to the substrate. This prevents overheating, improves energy efficiency, and stabilizes the brightness and color fidelity of the display — which is particularly critical in the miniaturization of MiniLED and MicroLED technologies. 

The results show that directional adhesives for miniLEDs are not only technically feasible but also function reliably under practical long-term conditions. This means that the technology is evolving from a feasibility concept to a validated bonding technology – one that optimizes miniLED manufacturing and enables the transition to series production of microLED displays.
Maximilian Baum, Director of Product Management Consumer Assembly & Equipment at DELO

The findings were presented by DELO experts at MicroLED Connect – the world's leading trade event for microLED technology, which took place in Eindhoven on September 24–25. 

Learn more about the detailed results of the study in our white paper:

Research and industrial relevance

The current study is part of a series of fundamental research projects that DELO supplements with over 3,000 customer tests annualy. With its expertise, DELO supplies leading industrial partners, including Infineon, Mercedes-Benz, and other players in the semiconductor, automotive, and consumer electronics sectors.

Our experts will help you plan your projects efficiently and implement them successfully. 

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Features of microLED, miniLED and OLED

FeaturemicroLEDminiLEDOLED
Max. brightness4,000+ nits1,000–4,000 nits400–1,000 nits
Lifespan>100,000 h60,000–100,000 h30,000–50,000 h
Burn-in risk❌ No❌ No⚠️ Yes
Black levels✅ PerfectVery good ✅ Perfect
Energy efficiencyVery highGoodAverage
Color representation
(accuracy + color gamut coverage)
Very high (DCI-P3 > 99%, Rec. 2020 ~ 90%)High (DCI-P3 ~ 90%)Very high (DCI-P3 > 99%, Rec. 2020 ~ 75–85%)
Color depthUp to 12-bit possibleMostly 10 bitsUp to 12-bit possible
Contrast ratioVirtually infinite (true black)High, but limited by LCD layerInfinite (pixels dimmable)
Latency/response timeVery low (< 1 ms)Low (2–5 ms)Very low (< 1 ms)
Viewing angle stabilityVery highAverage to goodVery high
CostVery highHighModerate
Market availabilityVery low (high-end/niche)Limited (premium segment)High – widely available
ConstructionThinThickVery thin

About DELO

DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.

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