Display resolutions have continued to increase over the past few years. At the same time, LED chips for backlighting units, for example, have become smaller and smaller. The solder pastes used in serial production are increasingly reaching their limits in terms of mechanical properties and isotropic electrical conductivity. 

DELO has specifically analyzed the feasibility of high-tech adhesives as a possible alternative to this established bonding method in a feasibility study.

Systematic testing shows that adhesives such as DELO MONOPOX AC268 prevent electrical short circuits in semiconductor components due to their intrinsic unidirectional conductivity, despite their reduced dimensions. In addition, it allows precision printing processes to be optimized, as larger stencil openings can be used. This significantly reduces pressure exerted on the substrate during doctoring and reduces the risk of damage.