These intricate structures, termed micro dams, serve as barriers to control the flow of other adhesives used to secure circuit board components like processor chips in PCs and gaming consoles.

Micro dams are crafted with a specially designed adhesive DELO DUALBOND EG4797. Its high thixotropy index allows the adhesive to flow smoothly and precisely during dispensing. Once out of the needle, the adhesive becomes more viscous, allowing for stable microstructures to form. The dispensing needles have a diameter of less than 100 µm, roughly the thickness of a human hair. This allows for application up of over 20 ultra-fine lines, layered on top of each other, to construct tiny barriers up to 1 mm high without the need for intermediate curing.

After dispensing, the micro dam is cured in a single step, known as "wet-in-wet" curing. This significantly reduces process times, as previously each line had to be cured individually. Customers can choose between curing methods—UV light, heat, or a combination—offering flexibility in production.

This advancement answers the increasing demand for high-performance components and aligns with the trend of miniaturization, allowing more powerful functional units to fit on a single circuit board.