Adhesives

DELO MONOPOX

Heat-curing adhesives from DELO

To meet the most diverse customer requirements, DELO offers a wide range of heat-curing adhesives under the DELO MONOPOX brand. These are based on different chemical compositions: from epoxy adhesives with different hardener classes such as acid anhydrides or amines to heat-curing cationic epoxy resins and heat-curing acrylates. The portfolio is rounded off by DELO's own product class of mCD adhesives.

Heat-curing Structural Electrically conductive Thermally conductive

DELO MONOPOX Series

Versatile application options

Among the most resistant adhesives

DELO MONOPOX adhesives can easily meet the high requirements for mechanical protection, chemical resistance and temperature resistance in numerous applications. These adhesives are particularly interesting for applications in the automotive industry and in electronics.

The right adhesive for every application

The curing temperature of the products in the DELO MONOPOX portfolio ranges from +60 °C, suitable for temperature-sensitive assemblies, up to +150 °C to achieve very durable bonds.

Electronic Grade

DELO MONOPOX EG products

  • Optimized for bonding in electronic components (Electronic Grade)

  • Very low halogen content
  • High cycle rates possible due to thermode curing
  • Adjustable mechanics from stress-relieving to high-strength
  • Used for: Reinforcement, Cap bonding / Lid attach, Camera Modules, etc.

Die Attach

DELO MONOPOX DA products

  • Developed for chip bonding (Die Attach)

  • High cycle rates possible through thermode curing
  • Electrically insulating
  • Mechanical properties adjustable from stress-relieving to high-strength
  • Used for: Reinforcement, NCA The Attach, etc.

Anisotropic Conductive

DELO MONOPOX AC products

  • Anisotropic electrically conductive

  • Reliable electrical contacting
  • Suitable for contact pads with narrow spacing
  • Curing achieved through thermocompression
  • Used for: ACA The Attach, Conductive Adhesives & Shielding Materials (functional materials), etc.

General Encapsulant

DELO MONOPOX GE products

  • Optimized for encapsulation applications (General Encapsulant)

  • Tailored coefficient of thermal expansion
  • Excellent resistance to media
  • Adjustable mechanical properties from stress-relieving to high-strength
  • Used for: Encapsulation, Industrial Solutions, Encapsulation & Potting (functional materials)

Low Temperature

DELO MONOPOX LT products

  • Low curing temperature

  • Rapid light fixation for the alignment of components
  • Consistent cure shrinkage and low swelling
  • Very low outgassing
  • Used for: Speaker Modules, etc.

High Temperature

DELO MONOPOX HT products

  • Developed for high-temperature applications

  • Optimized for structural bonding with high strength
  • High temperature resistance and high chemical resistance
  • Used for: (New) Electric Vehicle, Structural bonding (functional materials), etc.

Structural Joining

DELO MONOPOX SJ products

  • Optimized for structural joining

  • High temperature resistance and high chemical resistance
  • Easy handling in terms of storage and processing
  • Robust universal adhesion strength
  • Used for: (New) Electric Vehicle, Industrial Solutions, Structural bonding (functional materials), etc.

Together with DELO you will find the adhesive solution that perfectly meets your specific requirements.

Are you ready to shape the future of your product development with us? Arrange a consultation with our experts and find the perfect adhesive for your next project.
 

Arrange a Consultation

Downloads

Further information on the products can be found in the related download files.

Factsheets (all products)

Technical Data Sheets |

Safety Data Sheets |

Instructions for use

Download from Portal

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