Adhesives for LED packaging

Flexible electronics

Flexible- and In-Mold Electronics

DELO's specialized adhesives play a crucial role in flexible LED manufacturing. They warrant reliable structural and electrical connections, exceptional flexibility performance, and efficient production processes. Whether for flexible displays, wearable electronics, in-molding applications, or overmolded components requiring mechanical durability - DELO has the right solution for all areas of advanced LED technology.

Key Advantages:

• Flexibility without compromise: Maintain properties under bending stress and thermal cycling
• Structural integrity and reliability: Resistant to mechanical stress and temperature variations during injection molding
• Production versatility: Compatible with jetting, screen printing, and stamping application methods
   

Anisotropic connection

Anisotropic electrical connection for mini and micro led applications

DELO's anisotropic conductive adhesives enable directional electrical connectivity while preventing short circuits in ultra-dense LED arrays. These innovative formulations conduct electricity vertically through the bond line while maintaining electrical isolation horizontally, allowing unrestricted application across substrates. The technology supports larger printing stencil openings and reduced squeegee pressure, extending equipment life and enabling the use of flexible transparent substrates. Ideal for next-generation miniLED and microLED displays where conventional soldering reaches its limits.

Discover our advanced miniLED and microLED adhesive solutions!

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Capillary underfill

Capillary underfill for reinforcement of LEDs and mini LEDs

DELO's capillary underfill adhesives provide essential mechanical reinforcement for sensitive LED connections, particularly in miniaturized applications. These specialized formulations flow precisely into microscopic gaps between components and substrates, creating robust protection against thermal cycling and mechanical stress. The low-viscosity adhesives ensure complete gap filling while maintaining optical clarity and electrical insulation properties.

Advanced features for LED applications:

• Ultra-fine gap penetration for gaps <50 µm in high-density arrays
• Low CTE and high glass transition for maximum thermal stability
• Reliable curing from 90°C for temperature-sensitive components
• Optimized flow properties ensure uniform distribution without voids

Perfect for high-density LED arrays and miniLED displays where traditional reinforcement methods reach their limits.

Learn more about our miniLED and microLED solutions!

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IR applications

IR filter adhesives with specific cutoff for seamless integration of IR applications

DELO's precision IR sensor adhesives provide essential optical bonding solutions for advanced sensor integration across consumer electronics. These specialized formulations maintain critical wavelength transmission characteristics while creating robust mechanical connections between optical filter elements and LED assemblies, effectively concealing sensors beneath the adhesive layer without compromising functionality.

• Selective wavelength transmission - maintains precise IR cutoff characteristics for smartphone cameras and sensors
• Optical transmission retention  - low-outgassing formulation minimizes degradation throughout component lifespan
• Invisible sensor integration - enables seamless hiding of sensors behind adhesive layers
• Long-term stability - prevents optical property drift in demanding applications

Ideal for smartphone sensors, camera modules, and advanced optical systems where precise IR filtering and invisible sensor placement are critical design requirements.