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Megatrends
Ensuring Reliable Data Storage and Processing
Advancements in technology in recent years have made data centers and storage essential. It’s where machines learn behaviors, information remains secure, and data can be processed in real time so that our modern world keeps moving. High-speed data processing and reliable storage are vital to the modern world.
Technological advancements, like artificial intelligence (AI) and big data, have heightened the demand and importance of reliable data centers where complex information is stored and processed . Hard disc drives (HDDs) and computing units, such as GPUs, are vital components of these centers, requiring the same high levels of reliability in their assemblies.
Factors including structural integrity and media resistance, among others, contribute to their longevity. DELO has a product portfolio that touches on all of these factors and more. From specially formulated adhesives to precise dispensing and powerful curing equipment, there is a product to fill every need.
HDDs
Hard disk drives (HDD) are central in big data storage. Their reliability is essential, considering their critical role in both client servers and large data centers. HDDs must operate non-stop at elevated temperatures, while providing speedy read / write operations and maintaining flawless functionality for several years.
To ensure these standards, it is critical that the adhesives used within the HDDs possess low outgassing and long-term performance stability.
DELO offers an adhesive portfolio specifically developed to meet these demands. Adhesives from our family of products including light-curing, heat-curing and dual-curing systems can be used for the variety of HDD bonding applications. These adhesives not only satisfy the extensive requirements for HDD bonding but also cure optimally without sacrificing the high UPHs found in HDD production and assembly processes.
DELO adhesives deliver low outgassing, fast curing, and high bond strength, as well as other beneficial attributes necessary for the proper bonding required in HDD applications.
Semiconductor Packaging
Semiconductors are essential for processing big data. DELO adhesives and equipment serve as key components for various sub-applications within their assembly, such as die attach, capillary underfill, and encapsulation. Our products support innovative reinforcement methods such as edge bond or corner fill.
As CPUs and GPUs increase in size and generate more heat, metal frames are required to reinforce the package since micrometers of distortion negatively affect performance. DELO’s stiffener-attach solutions were developed to address this issue effectively.
In addition, DELO’s micro-dam structures help minimize keep-out zones (KOZs) designed to manage underfill flow, reducing overall package size and supporting miniaturization trends.
DELO materials not only enable new and more efficient production processes today but also pave the way for future solutions, such as temporary bonding and the use of reworkable materials.
Optoelectronics and Optical Communication
Optical communication, where data is transmitted via light, represents one of the most advanced forms of data processing. This technology is increasingly used in data centers to process big data and emerging technologies like AI. Optical communication is extremely beneficial to tech companies as it offers greater efficiency, lower energy consumption, reduced costs and enhanced data handling capabilities compared to traditional methods.
DELO specializes in adhesives for optoelectronics applications. For optical communication, our portfolio offers products tailored for use in photonic integrated circuits (PIC) and optical transceivers. PICs are semiconductor chips that use optical signals to transmit information instead of electrons. Adhesives are used to bond optical fibers to the PIC, enabling data transmission to occur. These adhesives feature properties such as transparency to allow for light to pass, low CTE, high Tg, and fast fixation for easy assembly.
With reliable adhesives tailored for many forms of data transmission, processing, and storage, DELO stands at the ready with an extensive portfolio.
See a use case that applies to you? Want to learn more about how our products can be implemented to your application? Request a consultation with one of our experts and let us optimize your assembly process.
Innovation
DELO adhesives play a vital role in driving innovation across various megatrends, ensuring high performance and reliability in rapidly evolving technological landscapes. Discover how our solutions contribute to these exciting developments.
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
