Search
What are you looking for?
Please try our search function!
Search
Megatrends
More efficient technologies for tomorrow’s world
It’s no secret that artificial intelligence (AI), big data, and other technologies are actively revolutionizing our lives, from the way we do business to the media we consume in our free time. However, with how quickly these innovations are being normalized, many challenges are brought to the fore.
To elaborate, what binds these emerging technologies together are two things: the semiconductors which serve as the core of their operation, and the high-capacity data centers where this information is processed. As these technologies become a greater part of the norm, many challenges arise.
For one, the amount of energy consumed at their respective data centers is expected to double between 2025 and 2026 from 500 to 1,000 terabyte hours—more than that of Germany and South Korea combined. In addition, hurdles such as stresses caused by large semiconductor dies and difficulties in quality assurance for denser semiconductor packages further complicate matters.
This presents the challenge of finding a way to balance these two factors. How can AI and high-performance computing continue to progress and improve our day-to-day lives while at the same time making sure that it remains reliable and sustainable?
Fortunately, there are many solutions in which our adhesives can play a key role.
Silicon photonics
Optical communication based on silicon photonics is an up-and-coming method of data processing which uses optical signals, namely photons, to transfer information as opposed to electrons. This is not only a faster method of data processing but is also far more energy-efficient. It can save energy by up to an impressive factor of three when processing AI data compared to more traditional methods.
DELO produces several adhesive products which are ideal for use in silicon photonics, specifically when bonding optical components within photonic integrated circuits (PIC). These high-quality adhesives offer helpful properties such as reflow stability, high light transmission capability, and refractive-index matching that make them ideal for this application.
A caveat with silicon photonics, however, is that the technology has not yet matured to the point where data centers have fully embraced it. This, then, begs the question of what other, more established technologies can be as effective.
Advanced Packaging Solutions
For high performance computing, CPUs and particularly GPUs are vital elements. These components are increasingly getting more complex and larger and due to this, plus the added heat that comes with it, metal frames are needed to reinforce the package as every micrometer of distortion negatively affects performance. Stiffener-attach solutions developed by DELO are our answer to this ongoing adaptation.
In addition, we develop tailored functional materials optimized for other reinforcement applications such as lid attach or encapsulation.
DELO materials not only enable new and more efficient production processes today but also pave the way for future solutions, such as temporary bonding and the use of reworkable materials.
DELO materials are optimally suited for fully automated serial production. They can be applied by screen printing, stencil printing and jetting.
Tailor-Made Solutions
With AI and other high-performance technologies on the rise and more than just a novelty, it is high time for the world to adapt to their herculean energy demands and implement energy-conscious solutions. Fortunately, DELO stands at the ready with adhesive and curing products and processes to help propel these solutions forward.
If you would like to learn more about how our products can help semicon manufacturing at your organization, arrange a consultation with our experts!
Innovation
DELO adhesives play a vital role in driving innovation across various megatrends, ensuring high performance and reliability in rapidly evolving technological landscapes. Discover how our solutions contribute to these exciting developments.
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
