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With Activation on the Flow, DELO has developed a process technology that combines adhesive dispensing and preactivation in one step. This provides users with new options for designing their products and processes while reducing costs and carbon emissions. This technology is particularly suitable for bonding and encapsulating temperature-sensitive electronic components and offers an alternative to bonding processes previously used in industry.
With Activation on the Flow, the adhesive is already irradiated during the dispensing process, which begins the curing reaction even before the adhesive meets the component. After this combined process step, the components can be joined.
Another special feature of this technology is that exposed adhesive areas can be additionally irradiated and fixed after joining. This provides immediate initial strength, preventing the adhesive from flowing out and the components from slipping and making way for further processing. With or without additional UV fixation, the adhesive cures to its final strength without any additional process steps, even in undercuts and shadowed areas.
Adhesives developed specifically for Activation on the Flow are one-component epoxy resins, including the patented DELO KATIOBOND FA adhesives, which contain two different initiators that react to different wavelengths and initiate curing. It is only thanks to this dual-initiator system that the optional UV fixation step is possible. The adhesives are available with different mechanical properties and are highly resistant to media and temperature in its cured state.
In addition, DELO has also developed a device especially for this process technology. DELO-ACTIVIS 600 consists of two subunits, one for dispensing and one for irradiation. Dispensing is done on a volumetric basis, with the flow rate and quantity being defined according to process requirements. As the one-component adhesive passes through the mixing tube, it is irradiated via integrated DELOLUX 503 curing lamps. The mixing coil ensures uniform activation of the entire volume of adhesive. DELO-ACTIVIS 600 can be used as a standalone device or integrated into existing production systems.
Activation on the flow combines the process steps of dispensing and preactivation by light, which enables innovative approaches to product design.
Activation on the Flow is particularly suitable for bonding and encapsulating temperature-sensitive components. For example, for a gentler process, sensors or connectors can be bonded with low stress using dual-initiator adhesives. None of the components need to be transmissive to light, and the adhesive cures reliably, even in complex geometries.
Activation on the Flow can replace various bonding processes widely used in the industry. It is an efficient and environmentally friendly alternative for heat-curing or dual-curing processes, can overcome previous limitations, and creates room for innovation.
Further information is provided in our white paper "Two in One: Activation on the Flow". If you have any further questions about this process or would like to know how you can integrate it into your production, take advantage of our free project consultation service.
DELO is a leading provider of high-tech adhesives, offering solutions for semiconductor, automotive and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies like Bosch, Huawei, and Siemens trust DELO for superior adhesive technologies.
