Press Release

DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials…

The Semicon Meets Sustainability virtual conference, organized by DELO, will take place on November 5, 2024 from 8:00 to 10:15 a.m. (CET) and in a…

DELO has conducted in-house feasibility studies, electrically and mechanically connecting miniLED dice using directional conductive adhesives. The…

DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds. DELO DUALBOND EG4797 thus creates new…

Voice coil motors (VCMs) have been an important part of smartphone camera assemblies over the last decade, enabling features such as image…

DELO has introduced a new microdispensing valve. The DELO-DOT PN5 LV pneumatic jet valve is designed for dispensing low-viscosity adhesives and other…