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Everything you need to know about DELO
Get instant answers to common questions about our products, applications and services
Whether you're exploring DELO adhesives for the first time or looking for specific technical information, our FAQ section provides quick answers to help you find the right solution. Browse through our organized categories to discover more about product specifications, application possibilities and delivery options.
Explore how DELO adhesives are used across different industries and specific use cases.
Yes, depending on the adhesive chemistry, the mechanical properties of the adhesive can differ depending on the curing method. With dual-cured adhesives, a combination of properties is present. More precise details need to be clarified with an application engineer depending on the adhesive.
Yes, we have both UV acrylates and light-curing epoxies that have passed the test.
LOCA is the abbreviation for Liquid Optically Clear Adhesive. It is a liquid adhesive used for bonding display components (e.g. touch sensor to cover glass). Compared to OCA (optical PSA adhesive), a LOCA has the advantage that component tolerances can be compensated and higher BLTs can be achieved.
Yes, DELO offers among others light + moisture curing DELO DUALBOND adhesives that can be cured within seconds using UV curing in visible areas, thereby fixing the components. Remaining areas in possible shadow zones cure by means of moisture.
Yes, DELO offers a wide range of purely UV or dual UV + heat-curing adhesives for the structural bonding of optical elements.
Yes – and this is especially crucial for optical applications. Our LED adhesives retain their clarity and color stability even after prolonged exposure to UV, light and temperature, preventing any yellowing or hazing and preserving the quality of bonded application long-term.
Absolutely. Our LED adhesives are engineered to withstand continuous thermal stress. They reliably maintain their bonding strength and mechanical properties even at elevated operating temperatures, ensuring a durable and secure bond.
Yes! Our LED adhesives are specifically formulated to minimize outgassing. Once cured, they release no volatile substances – making them ideal for sensitive electronic assemblies where contamination must be avoided.
During the curing of acrylates, radicals are formed which can react with atmospheric oxygen at the surface. The oxygen “scavenges” these radicals and slows down or prevents the desired curing of the adhesive at the surface. This results in a tacky surface.
Measures to reduce or prevent this include, for example, inerting with nitrogen or applying a higher UV dose during exposure. In terms of chemical formulation, there are also options to prevent or reduce this tackiness, for example through the addition of wax or the use of multifunctional monomers (higher crosslink density).
Thermally conductive adhesives are required whenever heat must be reliably dissipated without allowing electrical current to flow – for example when attaching power semiconductors to heat sinks, in LED modules or in automotive electronics. Unfilled polymers achieve only approximately 0.2 W/(m·K); through ceramic fillers such as aluminum oxide (Al₂O₃), thermally conductive adhesives achieve a specific thermal conductivity greater than 1.0 W/(m·K). DELO develops and produces thermally conductive adhesives (product designation TC – Thermally Conductive) from the DELO MONOPOX, DELO DUALBOND and DELO-DUOPOX product families for industrial high-performance applications.
An anisotropically electrically conductive adhesive (ACA) conducts current exclusively perpendicular to the bonding plane (Z-direction), thus reliably preventing short circuits between adjacent contacts – even at contact spacings in the micrometer range. Conductivity is created by suitable particles that are clamped between the surfaces to be contacted under defined pressure during joining, thereby establishing a direct metallic connection. The main application is flip-chip mounting on RFID and smart label substrates. Since cycle times in the range of seconds are required in these applications, the adhesives are cured using special thermode systems that enable rapid heating of the adhesive through direct component contact and also provide the necessary pressure for pressing the joining parts together. Curing in an oven is also possible; here, suitable clamps can be used to apply the necessary pressure to the joining parts. DELO produces ACA adhesives under the designation AC (e.g. DELO MONOPOX AC) with formulations that cure from 60 °C, enabling reliable processing of polycarbonate films and other temperature-sensitive substrates.
Isotropically electrically conductive adhesives (ICA – Isotropic Conductive Adhesive) conduct electrical current uniformly in all spatial directions. They are typically highly filled with silver particles that form a continuous conductive matrix. Typical applications include the electrical contacting and mechanical fixation of components in electronics manufacturing, such as grounding in camera modules or chip mounting. Since these adhesives can cure at temperatures as low as 80 °C, ICA adhesives are used, for example, where soldering or reflow processes are not possible due to thermal sensitivity. DELO develops and produces isotropically conductive adhesives under the product designation IC (e.g. DELO MONOPOX IC and DELO DUALBOND IC) and advises customers on process-reliable selection and processing.
LABS (lacquer wetting impairment substances) refers to the contamination of component surfaces by migrated silicone molecules, which can permanently disrupt or reduce the adhesion of lacquers and adhesives – which is why silicones are generally prohibited in many manufacturing environments. DELO has developed a proprietary alternative with mCD chemistry (Modified Carbamine Derivate), which offers a low modulus of elasticity and thus very good stress compensation even at low temperatures down to -40 °C. mCD-based adhesives from the DELO MONOPOX and DELO DUALBOND families cure at temperatures as low as 80 °C, are halogen-free according to IEC 61249-2-21 and cover the operating temperature range from −40 °C to +150 °C.
Mixed bonds between materials such as metal, plastic, glass or ceramic require an adhesive that adheres to all surfaces while permanently compensating for the different coefficients of thermal expansion (CTE) of the joining partners – because even minor temperature changes generate peel forces without stress compensation that cause the bond line to fail. Suitable systems combine good adhesion on the substrates used with a suitably low modulus of elasticity and high elongation at break. DELO also recommends designing the joining zone to be adhesive-friendly already in the design phase: sufficiently large bonding areas, uniform stress distribution and centric force introduction to avoid bending or peel moments are crucial. With its adhesive product families and the freely accessible knowledge portal, DELO provides well-founded application knowledge for mixed bonds.
Depending on the application, DELO has a large number of end-use-oriented component tests (= test vehicles), which are closely based on actual geometries and materials and provide very good insights into suitability. In many cases, long-term durability tests can also be carried out with them.
Many adhesives, especially with regard to semicon / advanced packaging, have been developed and tested based on this. Typically, mechanical properties as well as adhesion are verified and this is also indicated in the technical data sheet.
Adhesives are used in far more diverse areas of semiconductor packaging than often assumed. Key applications include:
Choosing the wrong adhesive can lead to critical failures in the semiconductor package:
CTE (Coefficient of Thermal Expansion) describes how much a material expands or contracts with temperature changes. In semiconductor packaging, the chip and substrate are often made of different materials with different CTEs. If the adhesive does not compensate for this mismatch, thermal stress builds up during operation or reflow processes — leading to cracks, delamination, or solder joint failure. A low CTE in the adhesive minimizes these stresses and is therefore one of the most critical selection criteria for semiconductor packaging adhesives.
Optical semiconductor packaging requires adhesives that meet both mechanical and optical performance criteria simultaneously. Key requirements include:
DELO offers a broad portfolio of adhesives specifically developed for optical semiconductor packaging, including products from the DELO PHOTOBOND and DELO KATIOBOND families.
Yes - DELO offers adhesives that can be used in screen printing/stencil printing.
The simplest way to dispense adhesive from small cartridges is using time/pressure dispensing methods. A suitable device is the DELOMAT 101.
The basic parameters that need to be set on the DELOMAT 101 are the media pressure and the dispensing time. The more pressure applied and the longer the dispensing time is set, the more adhesive will be applied. In addition to pressure and time, the dispensing needle used plays a crucial role.
When selecting a suitable dispensing needle, viscosity, fillers, target volume, and available space in the application are decisive factors.
'Fast' has many possible dimensions in the context of dispensing.
To achieve high throughput, I can dispense adhesive with high pressure through a large needle. Additionally, a dispenser that actively promotes the adhesive can be used. This can be, for example, an eccentric screw pump like the DELO-DIV VD.
To dispense small dots quickly in succession without Z-movement and thus save movement time, a contactless dispensing system such as a jetter from the DELO-DOT PN5 family can be used.
Small cartridges up to approximately 50ml volume typically have a Luer-Lock connection and are directly connected to the dispensing system. These cartridges are then usually dispensed using compressed air.
Larger cartridges can be connected to the dispenser via a threaded connection using a media hose. The adhesive is then fed from the cartridge using compressed air (via a pressure tank) or, even better, with a mechanical dispensing device.
Bottles are typically emptied using pressure tanks such as the DELO-XPRESS 951 NK. The adhesive is directed to the dispensing system via a media hose.
In principle, very small amounts of adhesive can be dispensed through needle dispensing using fine dispensing needles, e.g., with a dispensing valve. Similarly small dispensing volumes in the nanoliter range can also be dispensed with jet systems like the DELO-DOT PN5.
Even smaller amounts can be dispensed using, for example, inkjetting or other specialized processes.
To clean liquid adhesive, solvents can generally be used. It is important to match the compatibility of the solvent with the respective adhesive, as different adhesive chemistries are compatible with various solvents. Additionally, compatibility with the materials used in the dispensing system must be ensured. It can often be advantageous to initially flush the dispensing system with solvent to reduce the cleaning effort.
Before restarting operation, it must be ensured that all parts of the dispensing system have been freed from solvent.
Yes, there are underfill adhesives. With capillary underfill, the adhesive flows under the chip through capillary action.
Yes, DELO offers an extensive range of adhesives with defined optical properties - specifically for optical manufacturing. With refractive indices from 1.466 to 1.715, controlled haze values, anti-yellowing protection, and reflow-stable formulations, these adhesives are specially developed for high-precision optical applications.
Yes, DELO offers adhesives with reduced skin irritation risk. These are biocompatibility-tested according to ISO 10993, free from substances of concern, and still provide full technical performance. Application areas for skin-compatible adhesives include, for example, medical-adjacent fields such as wearables.
Yes, there are automotive-qualified products. These are explicitly designated as "Automotive Grade".
Special properties and requirements:
The fast and reliable manufacturing of components for autonomous vehicle sensors can be carried out cost-effectively and reliably with the help of active alignment adhesive processes. DELO offers both the adhesives and the necessary dispensing and curing equipment from a single source.
DELO is certified to IATF 16949 and ISO 9001. IATF 16949 is the internationally recognized quality management standard for the automotive industry and defines requirements for development and production processes along the automotive supply chain. ISO 9001 confirms compliance with a systematic quality management system. These certifications form the basis for the use of DELO adhesives in demanding automotive applications.
Many DELO adhesives exhibit high resistance to gear oils, coolants, and other media. However, the actual media resistance depends on the chemical base, temperature, duration of exposure, and the specific medium involved. For a reliable assessment, the technical data sheets of the respective DELO adhesive should be consulted.
Some DELO adhesives offer properties relevant to various applications in axial flux motors, such as magnet bonding or structural joining. DELO is actively engaged with the specific requirements of axial flux motors and is investigating suitable adhesive solutions for this drive technology. The selection of an appropriate adhesive depends on factors such as rotational speed, thermal load, installation space, and the manufacturing process.
DELO is working on material concepts for applications that require both bonding functionality and electromagnetic shielding. EMI shielding can be achieved through special fillers that reflect or absorb electromagnetic waves, thereby protecting sensitive electronic components from electromagnetic interference.
Yes, DELO offers adhesives with a UL 94 V-0 flammability classification. The UL 94 V-0 rating certifies self-extinguishing behavior of the material within defined test conditions. However, meeting this flammability requirement necessitates special formulations and additives, which may affect other properties of the adhesive. It is therefore advisable to evaluate the need for a UL 94 V-0 classification in the context of the overall application requirements.
Yes, magnets fixed with adhesive can generally be recycled. To facilitate disassembly at the end of the product’s service life, DELO is increasingly exploring concepts such as Debonding on Demand, where adhesive bonds can be selectively released under defined conditions. However, it should be noted that every adhesive application requires careful consideration of the balance between recyclability and the required performance characteristics throughout the entire service life of the motor.
Yes, end-of-line tests can often be performed shortly after the bonding process when using suitable DELO adhesives. End-of-line tests serve as 100% quality control of a complete process chain. For example, sensor components sealed with adhesive are actuated and the bond is tested for leak-tightness. Dual-cure DELO adhesives are particularly well-suited for such processes, as the light-fixation step enables them to achieve high strength within a short period of time.
As mechanical protection or protection against moisture, chemicals, or corrosion.
Active alignment is a high-precision adjustment process for optical components, where the optimal position is determined and fixed in real-time during bonding. Thus, optimal image quality can be achieved through high-precision positioning. The active alignment process can compensate for machine tolerances, component inaccuracies, and variations in image sensor mounting.
Active alignment enables the most precise manufacturing of optical systems through the combination of intelligent positioning technology and highly specialized adhesives.
Yes, there are biocompatible adhesives for medical applications. Some DELO adhesives are tested for biocompatibility and meet the requirements according to:
Various methods are available for adhesive application. Among others, screen printing or stencil printing is a method that can accelerate the application process. The UPH can thus be significantly increased compared to needle dispensing.
Important parameters for proper adhesive application with XYZ table are the media pressure, the traverse speed, the distance between dispensing needle & component, and the selected dispensing needle.
DELO offers various adhesives that are suitable for testing. In addition to the adhesive, the substrate and the selected application method are also decisive for dispensing fine lines.
With Activation on the flow, potting applications can be achieved that do not require heat curing. The adhesive is activated with light during dispensing and cures independently at room temperature.
The adhesive amount is influenced by the supply pressure, the valve opening time, the shot frequency, the nozzle temperature, and the selection of nozzle and plunger diameters.
For reproducible dispensing, constant ambient conditions such as room temperature and supply pressure are essential factors. Consistent dispensing can be promoted by nozzle heating, which is installed as standard in the DELO-DOT PN5.
Yes, filled adhesives can be jetted, i.e., dispensed contactlessly. However, it is important to select the nozzle size according to the filler size. As a rule of thumb, the nozzle bore should be at least 5-7 times larger than the largest filler particle.
When dispensing through a dispensing needle, depending on the adhesive viscosity, dispensing can also be done at an angle or even approximately horizontally. With contactless dispensing using a jet valve, it is usually possible to work completely horizontally or even overhead.
Since cured adhesive has already formed its network and thus behaves like a solid plastic, dissolving the cured adhesive is usually not possible. Therefore, often only careful mechanical cleaning using tools remains. Solvent-resistant parts of the dispensing system can also be placed in solvent for extended periods or using an ultrasonic bath to soften the cured adhesive residues and support mechanical cleaning.
Find information about shipping, international availability, and customer support services.
DELO is an international company with locations in Germany (headquarters), the USA, China, and Singapore. Additionally, we have a global sales team and local distributors in various regions.
Delivery Options:
We cannot provide a complete list of all countries we can deliver to, as each shipment is individually assessed. Export possibilities depend on various factors/assessment criteria:
Do you have a specific delivery inquiry? Please feel free to contact our sales team or your local representative. We will individually assess whether and under what conditions delivery to your desired destination country is possible.
When receiving goods, you should observe the following points:
Do not interrupt the cold chain for temperature-critical products - this can impair product quality.
Watch the video to lern how to handle temperature sensitive adhesives.
The processing time is 4-5 weeks from the respective arrival date at DELO. Please note that your device should arrive at one of the specified dates - devices that arrive later will only be considered in the next calibration period.
Further information and current dates can be found here:
We recommend annual calibration of your DELOLUXcontrol measuring device to ensure consistent quality of your production process.
Further information and current dates can be found here:
DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.
