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DELO has developed a reliable sealant for CMOS image sensors, which are often used in driver monitoring systems. DELO DUALBOND EG6290 is specially engineered for glass-on-die assembly, bonding glass filters directly to semiconductors. You as an end user can benefit from its narrow, high bondlines and high temperature resistance.
Glass filters can be bonded directly to the semiconductor chip using DELO DUALBOND EG6290. (Image: DELO)
Compared to other products, DELO DUALBOND EG6290 has a significantly higher Young's modulus of 2,350 MPa and significantly higher adhesion value. Due to a glass transition temperature (Tg) of over +130 °C, the adhesive exhibits mechanically consistent behavior. Even at high application temperatures such as in molding processes, it can compensate for temperature-dependent pressure changes, thus fulfilling the requirements of the AEC-Q100 Grade 2 automotive industry standard.
The adhesive is applied via needle dispensing. Thanks to its very high thixotropy index, narrow and high bondlines can be precisely dispensed, onto which the glass filter is then joined.
Curing takes place in two successive process steps.
The adhesive typically fully cures in 15 minutes at +130 °C. Due to the rapid curing reaction, the matrix in the adhesive builds up quickly, which ensures the image sensor package is reliably sealed.
Both its dual curing process and the comparatively low curing temperature help to minimize the pressure that usually occurs when bonding glass filters.
CMOS image sensors are essential components in modern vehicles and are installed, for example, in LiDAR and driver monitoring systems. They must be completely sealed to keep out dust and moisture and maintain their safety functions over their entire service life.
With this new product, DELO is expanding its portfolio of electronics adhesives, offering you yet another solution for closed-cavity packaging in addition to adhesives for glass-on-housing applications.
Do you have an upcoming project, or would you like to find out more about the possibilities of closed-cavity packaging? Consult our experts today! No obligation needed.
DELO is a leading provider of high-tech adhesives, offering solutions for automotive, electronics, and semiconductor industries for over 25 years. Our innovative technologies set industry standards. Companies like Bosch, Huawei, and Siemens trust DELO for superior adhesive technologies.
We are your touchpoint for high-tech bonding. Our specialist worldwide are keen to support you. Get in touch with us now!
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