Adhesives and optical materials for lighting solutions

From matrix LEDs on the front to the large OLED strips on the tail: LEDs ensure good vision and visibility in road traffic. They have also become one of the most important design features with which car makers can lend their vehicles a unique look. And new lighting solutions such as digital lights are always coming on the scene. Using this technology, cars can project an arrow onto the road when turning off to inform pedestrians and cyclists and thus increase road safety for all road users. Adhesives and optical materials are required for all these high-end lighting solutions. With its many years of expertise in optoelectronics, DELO is the preferred partner of automotive suppliers.

DELO adhesives for LED packaging

LEDs in vehicle head lights and rear lights help to increase road safety. They improve lane illumination and reduce dazzling of oncoming road users significantly. Thanks to their design, they also unlock possibilities for miniaturization and increased efficiency.

Functional adhesives play a key role in the manufacture of LED packages. They ensure brilliant, homogeneous diode illumination and fast production. DELO has developed a host of suitable products for both first- and second-level packaging. In first-level packaging, the adhesives are applied in the immediate vicinity of the LED semiconductor. In second-level packaging, the adhesives are used to join lenses, cover disks or housings that are used around the LED module.

DELO's adhesive portfolio for optoelectronics includes transparent and low-outgassing, tension-equalizing and electrically conductive adhesives, and die attach to structural bonding. Optical coatings with customized properties regarding transmission, reflection and absorption, as well as encapsulants to protect sensor packages, are also offered by DELO. Users can choose from products with different curing mechanisms depending on the relevant component geometry or substrate combination.

All DELO functional adhesives and sealants in its DELO PHOTOBOND, DELO DUALBOND and DELO KATIOBOND series are particularly suitable for highly automated high-speed processes with high outputs.

Properties of adhesives for LEDs

  • Low-outgassing
  • Very low shrinkage
  • Optically clear
  • Yellowing-resistant
  • Reflow-resistant

Materials for micro-optics and nanostructures

Micro-optics and nanostructures are key technologies for new and continuously developed electronic components such as infrared (IR) projectors, time-of-flight (TOF) sensors and augmented reality (AR) structures. With its new, fast-curing and highly transparent imprint materials, DELO enables its customers to forge ahead with these developments.

The lenses and structures are produced using imprint lithography, which enables high production volumes and offers several advantages compared with conventional injection molding. Corresponding adhesives are also available for wafer bonding.


  • High resistance to yellowing at elevated temperatures, especially in reflow processes
  • Very high transmission in the visible range
  • Low outgassing
  • Very low shrinkage
  • Excellent adhesion to glass and simultaneous debonding from stamp materials
  • Halogen-free (IEC 61249-2-21)



  •     UV replication
  •     Nanoimprint
  •     Microlenses
  •     Micro-lens arrays
  •     Diffusers
  •     Diffractive optical elements (DOE)
  •     UV imprint lithography

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