Industrial adhesives for all applications | DELO

EAC 2023

地点/大厅: Booth C-055

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Suzhou | China

The Enmore Automotive Conference (EAC) is one of China’s largest gatherings of professionals working in the automotive industry, from OEMs to infotainment developers, to audio companies and sensor manufacturers.

DELO will be present in this conference providing insights to attendees on bonding solutions for automotive sensors in Advanced Driver Assistance Systems (ADAS)​​​​​​​, used in features such as adaptive cruise control, blind spot detection or emergency braking.

SEMICON China 2023

地点/大厅: T1431

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Shanghai New International Expo Centre | China

SEMICON China connects you to the fastest growing and most dynamic microelectronics market in the world, providing you with a platform to showcase your products and technologies to China’s most qualified professionals.

DELO Topics:

• Adhesives for semiconductor packaging (Edgebond, glass lid attach, capillary underfill, partial encapsulation, CPU lid attach, corner fill)
• UV-fixable glob top (inline shape fixation, Super low CTE)
• Image sensor glass attach (Highest reliability, Reliable process control)

CIOE 2023

地点/大厅: 7D25

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展台: 7D25

Shenzhen World Exhibition & Convention Center | China

China International Optoelectronic Exposition (CIOE) is known as the world's leading optoelectronics exhibition covering the entire optoelectronic ecosystem. More than 3,000 optoelectronic exhibitors will showcase the world's latest products at six sub-exhibitions, from materials, components, modules and devices to various optoelectronic applications.

With 24 years of successful experience, CIOE is now the most popular exhibition for experts and buyers from all over the world to learn about optical communication, precision optics, sensor, laser, infrared and photonics products.

DELO will present its latest developments in optoelectronics, including DELO adhesives for LED packaging, materials for micro-optics and nanostructures, smart glassesand periscope camera.

Visit us and talk to our experts about innovative solutions for your specific challenges!

EMPC - European Microelectronics & Packaging Conference 2023

地点/大厅: 13

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Genome Centre, Cambridge | UK

The 24th European Microelectronics & Packaging Conference (EMPC) lets you dive deep into the latest developments in all facets of the semiconductor industry. New materials for electronic packaging and potential system applications will be showcased by leading companies as well as academic institutions.

DELO will be presenting its high-tech reinforcement materials that help increase the durability and ruggedness of their applied components, as well as its latest solution for lid attach. Thanks to their airtight seal, DELO materials help provide sensors with the utmost protection.