日程安排






地点/大厅: Booth 10
San Francisco, CA | USA
The Wafer-Level Packaging Symposium hosted by SMTA, an international association of electronics engineers, is anticipated to be one of the largest gatherings of industry experts and thought leaders in the United States, with a focus on advanced packaging and adapting it to the age of AI.
DELO will be present to demonstrate its reliable UV-curing encapsulation materials for fan-out wafer-level packaging. Talk to our experts at the symposium and we can discuss possible target applications.
We are looking forward to seeing you at the Wafer-Level Packaging Symposium!
地点/大厅: B0.516
25 - 27 February 2025 | Messe München (Germany)
Flexible Electronics Area
LOPEC (Large-area, Organic & Printed Electronics Convention) is the world's leading trade fair and the most important congress for flexible, organic and printed electronics.
DELO presents itself at LOPEC as a solution provider for flexible electronics. Our focus is on innovative, conductive adhesives for flexible and molded electronics as well as on modern dispensing equipment. With these advanced solutions, we aim to drive the development of groundbreaking electronic applications. Visit us at LOPEC and discover DELO's conductive adhesives.
We look forward to your visit and to exchanging ideas with you! Find out more about LOPEC now.
地点/大厅: 600
Phoenix, AZ | USA
The IMAPS International Conference & Exhibition on Device Packaging is a major forum for the exchange of knowledge in the field of microelectronics, with numerous technical demonstrations and networking opportunities throughout the event, attracting attendees in both industry and academia. DELO is proud to be a corporate sponsor of this event.
We will be showcasing our adhesive and dispensing process solutions for advanced packaging systems such as Fan-Out packaging in more complex multi-chip setups. Also to be demonstrated are our solutions for photonic IC (PIC) packaging, including optical coupling, fiber packaging, cladding, and OE attach.
In addition to technical innovations, DELO focuses on sustainable solutions that can reduce both the use of materials and CO2 emissions. These will also be presented at the conference.
And make sure to join us at our presentation, „Micro dam structures - How to utilize them in advanced semiconductor packaging and verify correct application inline“. We hope to see you there!
地点/大厅: 3-A07
Augsburg | Germany
Coilech is one of the most important events in the coil winding industry, occurring each year in Pordenone, Italy and Augsburg, Germany. This exhibition is entering its 3rd year in Augsburg on March 20 and 21, 2024 with hundreds of exhibitors expected to be present – developers as well as manufactures and maintainers of electric motors, transformers, and generators.
DELO will present the latest developments in adhesives for electric motor applications, where coil windings also play a significant role. Find us at booth 5-B15 and talk to our experts about your bonding challenges.
Want to know more about the exhibition?
Find out here
地点/大厅: Hall W1 / Booth 1600
Shanghai New International Expo Centre | China
Productronica China is one of the leading platforms for innovative electronics development and production. The forums highlight current market trends and technologies.
DELO presents the latest developments in industrial adhesives and corresponding dispensing and curing technology for the semiconductor industry, the automotive industry and consumer electronics. Among other things, we will present our hightech reinforcement materials for edge bond and corner fill applications as well as solutions for closed cavity packaing.
Stop by our booth 1600 and talk to our experts about your bonding challenges.
地点/大厅: B2625
20 - 22 May 2025 | Sands Expo and Convention Centre (Singapore)
Semicon area
SEMICON Southeast Asia is the leading event for electronics manufacturing in Southeast Asia, bringing together professionals from across the electronics industry. In 2025, this prestigious event will celebrate its 30th anniversary. Take the opportunity to engage with experts from over 500 local and international companies at more than 1,000 exhibition booths.
If you're interested in the latest innovations in the semiconductor sector, such as new adhesive and process solutions for enhanced solder joints, we warmly invite you to visit our booth. There, we will showcase not only our state-of-the-art dispensing devices and curing lamps but also "Activation on the Flow." This technology integrates dispensing and preactivation in a single step, helping you reduce your CO2 emissions by up to 98%.
We look forward to welcoming you and having insightful conversations with you! Learn more about SEMICON Southeast Asia now and get your free ticket.
4 - 6 June 2024 | Hangzhou (China)
Automotive area
The Enmore Automotive Conference (EAC) is one of China's largest gatherings of professionals working in the automotive industry, from OEMs to infotainment developers, to audio companies and sensor manufacturers.
DELO will be present in this conference providing insights to attendees on bonding solutions for automotive sensors in Advanced Driver Assistance Systems (ADAS), used in features such as adaptive cruise control, blind spot detection or emergency braking.
We look forward to your visit and to exchanging ideas with you! Find out more about the EAC now.
CWIEME is the world's largest exhibition for coil windings, transformers, generators, electric motors and e-mobility. The exhibition, which is a global hub for the industry, turns 28 this year. Over 600 exhibitors and more than 6,700 visitors are expected.
DELO will present the latest developments in the field of e-motors, ESC inverters and sensors. At the same time, the jetting process of balancing compounds will be demonstrated.
地点/大厅: 47
Grenoble | FR
The 25th European Microelectronics & Packaging Conference (EMPC) lets you dive deep into the latest developments in all facets of the semiconductor industry. New materials for electronic packaging and potential system applications will be showcased by leading companies as well as academic institutions.
DELO will be presenting its high-tech reinforcement materials that help increase the durability and ruggedness of their applied components, as well as its latest solution for lid attach. Thanks to their airtight seal, DELO materials help provide sensors with the utmost protection.
Join our presentation about ”Adhesive Solutions for Closed Cavity Packaging" and talk to our experts! We are happy to seeing you!
地点/大厅: 1
24 - 25 September 2025 | Eindhoven (Netherlands)
MicroLED area
MicroLED Connect brings together researchers, developers and manufacturers from the industry to discuss the latest developments and challenges for MicroLED applications. The conference is taking place in Europe for the first time this year and promises dynamic exhibitions and masterclasses from the leading experts.
Do you have your own Micro LED applications and would like advice on your options and solutions? Visit DELO at MicroLED Connect in Eindhoven (Netherlands) on 25 and 26 September and exchange ideas with our specialists.
Want to find out more? Learn more about MicroLED Connect now.