地点/大厅: 24
Fountain Hills, AZ | USA
The IMAPS International Conference & Exhibition on Device Packaging is a major forum for the exchange of knowledge in the field of microelectronics, with numerous technical demonstrations and networking opportunities throughout the event, attracting attendees in both industry and academia. DELO is proud to be a corporate sponsor of this event.
We will be showcasing our adhesive and dispensing process solutions for advanced packaging systems such as Fan-Out packaging in more complex multi-chip setups. Also to be demonstrated are our solutions for photonic IC (PIC) packaging, including optical coupling, fiber packaging, cladding, and OE attach.
In addition to technical innovations, DELO focuses on sustainable solutions that can reduce both the use of materials and CO2 emissions. These will also be presented at the conference.
And make sure to join us at our presentation, UV for Fan-Out: Taking warpage out of the equation, on March 19th, 2024 at 04.00 pm to hear more from our experts. We hope to see you there!
地点/大厅: 3-A07
Augsburg | Germany
Coilech is one of the most important events in the coil winding industry, occurring each year in Pordenone, Italy and Augsburg, Germany. This exhibition is entering its 3rd year in Augsburg on March 20 and 21, 2024 with hundreds of exhibitors expected to be present – developers as well as manufactures and maintainers of electric motors, transformers, and generators.
DELO will present the latest developments in adhesives for electric motor applications, where coil windings also play a significant role. Find us at booth 3-A07 and talk to our experts about your bonding challenges.
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地点/大厅: Hall E6 / Booth 6635
Shanghai New International Expo Centre | China
Productronica China is one of the leading platforms for innovative electronics development and production. The forums highlight current market trends and technologies.
DELO presents the latest developments in industrial adhesives and corresponding dispensing and curing technology for the semiconductor industry, the automotive industry and consumer electronics. Among other things, we will present our hightech reinforcement materials for edge bond and corner fill applications as well as solutions for closed cavity packaing.
Stop by our booth 6541 and talk to our experts about your bonding challenges.
地点/大厅: 12D23 / hall 1.2
Messe Berlin | Germany
CWIEME Berlin is the world's largest exhibition for coil windings, transformers, generators, electric motors and e-mobility. The exhibition, which is a global hub for the industry, turns 27 this year. Over 600 exhibitors and more than 6,700 visitors are expected.
DELO will present the latest developments in the field of e-motors, ESC inverters and sensors. At the same time, the jetting process of balancing compounds will be demonstrated.
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