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Semiconductor Packaging
DELO materials ensure maximum reliability
Effective protective components are essential to ensure the reliability of semiconductor packages. For example, highly sensitive image sensors are protected by special filter glasses that are either bonded directly onto the chip or the housing. For packages such as CPUs and GPUs, on the other hand, so-called heatspreaders are used. Among other things, they are used to dissipate heat and prevent mechanical damage to the chips underneath.
Bonding both heatspreaders (cap bonding) and filter glasses (lid attach) is challenging, as there is a danger of deformation due to the differences in material expansion and the pressure that can build up in the hollows. In such cases, choosing the right adhesive is crucial.
DELO offers innovative solutions for these demanding applications in semiconductor packaging. Our products for cap bonding and lid sealing are specially developed to meet the high challenges and to ensure a permanently secure bond.
Cap Bonding
Optimizing heat dissipation and bonding for extended CPU/GPU performance
Heatspreaders are not only used on PCBs to distribute the heat of the die, but also act as housing to protect the processor. Due to the difference in thermal expansion between the PCB material and the heatspreader, which is typically made of copper alloys, bonding is challenging.
High-tech materials are used to ensure that the component does not deform during the reflow process or in the event of temperature changes. DELO specializes in heatspreader bonding for processors and has developed both tension-equalizing and extremely stiff products that allow the layer thickness to be optimally adjusted and guarantee fast curing. With our products, you can ideally protect your CPUs and GPUs so that they function reliably over the long term.
Talk to our semiconductor specialists about your specific challenge.
Lid Attach
Reliable sealing for image integrity
The development of autonomous driving places the highest safety requirements on vehicle components. Image sensors in particular, such as those integrated in LiDAR or driver monitoring systems, must function reliably over the long term. The hermetical sealing of components assembled on printed circuit boards plays a decisive role in the long-term protection of complementary metal oxide semiconductors.
DELO offers a comprehensive portfolio of high-quality semicon adhesives that are specially designed for image sensors and their use under the most adverse conditions and meet high requirements such as the reliability and qualification tests of the automotive industry, for example according to AEC-Q100.
With DELO adhesives, your image sensors are optimally protected over their entire lifetime and retain their unrestricted functionality. Rely on DELO for maximum reliability and protection of your complementary metal oxide semiconductors.
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
