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Semiconductor Packaging
Maximum lifetime for your semiconductor packages
Different methods can be used for the mechanical reinforcement of BGAs and other assemblies. Whether capillary underfill, corner fill, or edge bond - each method offers its own advantages and varies in terms of degree of reinforcement, material usage, process speed, reworkability and CO2 footprint.
DELO has developed specific products for all areas. In addition to these reinforcement adhesives, we also offer a wide range of functional and conductive materials for die attach applications and flip-chip processes.
Let our Semicon specialists consult with you and find the ideal solution for your semiconductor applications.
Die Attach
Streamlining sophisticated chip bonding processes
Die attach adhesives play a decisive role in the electrical contacting of chips using wire bonding. With the increase in chip size, for example in image sensors, the demands on the materials used are also increasing. Among other things, this calls for a combination of seemingly contradictory properties: a low Young's modulus combined with minimal thermal expansion.
DELO has developed customized solutions for Die Attach that deliver excellent results in tests according to JEDEC MSL or AEC Q100. Our materials are optimized for the specific applications in chip bonding, and guarantee reliable and efficient contacting and bonding - even under the most challenging conditions, such as those required by the automotive industry.
Capillary Underfill
Maximum reinforcement of BGAs through laminar underfill
With capillary underfill materials, you can achieve the greatest possible reinforcement of your chip packages. In this process, the adhesive is applied to the side of the soldered package and is distributed evenly under the entire component. The adhesive is then cured by heat, guaranteeing a reliable and permanent connection.
DELO offers a variety of semiconductor adhesives specifically designed for fast and reliable underfill processes.
With our micro dam materials, you can build tiny microstructures and reduce your keep-out zones (KoZ). Micro dam and underfill can be optimally coordinated in the process design.
Would you like to find out more about Micro Dam?
Corner Fill
Optimal reinforcement for large BGA packages
Corner fill is a material-saving way of permanently reinforcing SMD components and semiconductor chips. The corners of a component are underfilled with adhesive to guarantee increased stability precisely where the strongest mechanical loads occur.
Our corner fill materials ensure robust and durable reinforcement and are particularly suitable for large chip packages. They cure at low temperatures and thus allow the use of low-temperature solder, which reduces energy consumption during production. The materials we have developed do not only impress with their excellent properties, but also allow efficient processes.
Edge Bond
Maximize durability and flexibility while shrinking your carbon footprint
Edge bond solutions are a simple and cost-effective way to extend the lifetime of your assemblies while reducing your CO2 emissions. Compared to other methods, edge bond scores particularly well in terms of sustainability and reworkability. As the adhesive is only applied to the edges, the amount of material used is low. Additionally, UV curing ensures an energy-efficient process.
The electrical contacts are not touched by the adhesive during edge bonding, which ensures good reworkability of the components, provides additional flexibility, and enables cost savings.
DELO has developed a wide range of products specifically designed for edge bond applications to complete the portfolio of reinforcement solutions.
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
