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Semiconductor Packaging
Maximum lifetime for your semiconductor packages
Different methods can be used for the mechanical reinforcement of BGAs and other assemblies. Whether capillary underfill, corner fill, or edge bond - each method offers its own advantages and varies in terms of degree of reinforcement, material usage, process speed, reworkability and CO2 footprint.
DELO has developed specific products for all areas. In addition to these reinforcement adhesives, we also offer a wide range of functional and conductive materials for die attach applications and flip-chip processes.
Let our Semicon specialists consult with you and find the ideal solution for your semiconductor applications.
Die Attach
Streamlining sophisticated chip bonding processes
Die attach adhesives play a decisive role in the electrical contacting of chips using wire bonding. With the increase in chip size, for example in image sensors, the demands on the materials used are also increasing. Among other things, this calls for a combination of seemingly contradictory properties: a low Young's modulus combined with minimal thermal expansion.
DELO has developed customized solutions for Die Attach that deliver excellent results in tests according to JEDEC MSL or AEC Q100. Our materials are optimized for the specific applications in chip bonding, and guarantee reliable and efficient contacting and bonding - even under the most challenging conditions, such as those required by the automotive industry.
Capillary Underfill
Reduction of voltages by reinforcing the solder contacts
With capillary underfill materials, you can achieve the greatest possible reinforcement. The adhesive is dispensed from the side of the chip/package and is then distributed evenly underneath by the action of capillary forces. The adhesive is then cured by heat, guaranteeing a reliable and permanent connection.
With our micro dam materials, you can build tiny microstructures and reduce your keep-out zones (KoZ). Micro dam and underfill can be optimally coordinated in the process design.
Would you like to find out more about Micro Dam?
Corner Fill
Optimal reinforcement for large BGA packages
Corner Fill is a simple and time-saving way to reinforce the solder joint. The corners of a component are filled with adhesive in order to reduce stresses precisely where the strongest mechanical loads occur.
Our corner fill materials ensure robust and durable reinforcement. They cure at low temperatures and thus allow the use of low-temperature solder, which reduces energy consumption during production. The materials we have developed do not only impress with their excellent properties, but also allow efficient processes.
Edge Bond
Efficient reinforcement without underflow
Edge bond solutions are a simple and cost-effective way to extend the lifetime of your assemblies while reducing your CO2 emissions. Compared to other methods, edge bond scores particularly well in terms of sustainability and reworkability. As the adhesive is only applied to the corners around the component, the amount of material used is low. In addition, the optional UV curing ensures an energy-efficient process.
The solder contacts are not touched by the adhesive during edge bonding, which ensures good reworkability of the components, provides additional flexibility, and enables cost savings.
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
