Search
What are you looking for?
Please try our search function!
Search
Semiconductor Packaging
Reliable solutions for every need
The protection of semiconductor chips is essential to ensure their long-term functional capability. DELO offers an extensive range of products that have been specially for this purpose. Our portfolio includes a variety of potting compounds that can be used as dam & fill as well as glob top solutions. We carefully adapt our products to your individual requirement profile and offer solutions with tension-equalizing to hard, high-strength properties.
In addition, DELO offers innovative materials that can effectively limit potting to guarantee precise and reliable results. These high-tech adhesives can be used to design microstructures, so-called Micro Dams, which act as flow stops, in a very short time.
The protection of semiconductor chips is essential to ensure its long-term functional capability. DELO offers a wide range of products that have been specially developed for this purpose. Our portfolio includes a variety of potting compounds that can be used as dam & fill as well as glob top applications. We carefully adapt our products to your individual requirement profile and offer solutions with tension-equalizing to hard, high-strength properties.
In addition, DELO offers innovative materials that can effectively limit potting to guarantee precise and reliable results. These high-tech adhesives can be used to design microstructures, so-called Micro Dams, which act as flow stops, in a very short time.
Component Encapsulation
For lasting functionality and durability
Protecting individual components, especially on printed circuit boards or IC substrates, requires the highest precision in dispensing, fast curing and maximum resistance. These factors are crucial to maximize the lifetime of your components.
Our products are designed to meet your individual technical requirements and protect semiconductor components in the best possible way so that your technologies function optimally and permanently.
Wire Encapsulation
Air-free protection and filling of micro gaps
Semiconductor chips, such as fingerprint and image sensors, are typically contacted using wire bonding. DELO offers specially developed potting compounds to reliably protect the extremely fine, up to 20 µm thin wires from mechanical and chemical influences.
Our materials for wire encapsulation are ideally suited for use in close distances between wires. They are characterized by a combination of the smallest filler sizes and minimal thermal expansion combined with low viscosity. They therefore warrant the gapless filling of even the smallest gaps without trapped air. The low thermal expansion also minimizes the stress on the filigree wires during temperature changes, which increases the overall reliability and lifetime of the components.
Large-area Encapsulation
Distortion-free coverage and warpage-free potting
When large-area encapsulation and potting of components, such as wafers, heating during the curing process can result in undesirable warpage. This is often due to differences in the coefficients of thermal expansion of the materials used. Such warping can not only make handling of the curved components more difficult but can also impair their functionality. This becomes particularly critical in subsequent lithographic processes, such as the design of redistributed layers (RDL) in FOWLP/FOPLP, as their resolution can suffer as a result.
DELO offers a solution to this challenge: By using UV-curing high-tech materials, you can easily potting large-area components without distortion. Smooth further processing and full functionality are thus ensured.
We are your touchpoint for high-tech bonding. Our specialists worldwide are keen to support you. Get in touch with us now!
