Processes

Heterogeneous Integration

Miniaturization in semiconductor and microelectronics packaging is reaching its limits. New solutions are needed to expand the possibilities in the field of heterogeneous integration and optical packaging, such as micro dams - ultra-fine structures made of adhesive. They can reduce keep-out zones or act as optical barriers.

Micro Dam

Micro Dam – Ultrafine structures and barriers made of adhesive

Precision adhesives for complex circuit board designs

DELO offers you innovative materials that can be used to design microstructures on printed circuit boards. They create new possibilities in the field of heterogeneous integration and optical packaging. Limitless free-form structures and the finest optical barriers can be implemented with these high-tech materials.

Filigree structures with line widths of less than 100 µm and an aspect ratio of five or more can be easily realized with Micro-Dam adhesives. Perfectly suitable, for example, for limiting underfills during flow, our materials offer outstanding precision and control.

The special feature of DELO products is their high thixotropy index. This special feature describes the extraordinary adaptability of the viscosity to different flow rates. This makes it possible to dispense adhesive very quickly and at the same time build up stable microstructures. Whether on straight areas or complex, curved surfaces - our materials guarantee excellent results.

Technical specifications of Micro Dam materials of DELO

Halogen- and solvent-free acrylate
High stability
Dispensing speed: up to 26 mm/s
Heights of 1 mm can be realized with line widths of ~100 µm
Curing by ultraviolet light, heat or dual
Pass test standards such as JEDEC MSL

Areas of application for our materials

As a flow stop to reduce keep-out zones
Finest barriers in the manufacturing of optical sensors

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Whitepaper: Micro Dam

Discover how micro dam technology offers more space for innovation in semiconductor packaging by exploring our free whitepaper!

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