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Adhesives on printed circuit boards are not only used to fix components, but also for electrical insulation. To meet ever-increasing miniaturization requirements, they are required to be temperature-resistant and offer good dispensing properties. DELO MONOPOX EG2596 features high strength, even after aging, and can be dispensed even more precisely than its predecessor, DELO MONOPOX MK096. This has been shown in tests conducted in tandem with the machine integrator ASM Assembly Systems. This fluorescent adhesive is suitable for long-term use in a wide range of applications.
Die attach is a simple, yet crucial process in electronics manufacturing. All it is the bonding of a semiconductor die to a substrate such as a semiconductor package or printed circuit board. This process can be found in the manufacture of consumer electronics, medical devices, and automotive infotainment systems. In all of these applications, both adhesive strength and thermal management are critical to facilitating semiconductor performance.
One suitable adhesive is DELO MONOPOX EG2596, which exhibits 150% higher strength than its predecessor after seven days of storage at 85% relative air humidity and a temperature of +85 °C. It maintains its strong adhesion, even after typical aging tests like the MSL 1 test. When using 1x1-mm² silicon dies, the test revealed adhesion values of 47 N on an FR4 substrate and 62 N on gold.
Another advantage of this single-component adhesive is its high thixotropic index of ~9. A fact you should note is that the higher the index value, the more flow-resistant the dispensing pattern is after the dispensing process. The thixotropic properties of DELO MONOPOX EG2596 ensure that the adhesive can be applied very finely and at low viscosity due to the shear of the dispensing valve. After dispensing, within fractions of a second, the adhesive increases its viscosity again, preventing it from flowing. This allows the die attach to be created out of individual droplets and then structured without the adhesive spreading into areas that should remain adhesive-free. Even during heat curing, adhesive droplets remain dimensionally stable.
DELO MONOPOX EG2596’s flowability properties are designed to allow dispensing by way of jet or needle dispensing. Thanks to this flexibility, it can be used in many kinds of applications. Tests conducted jointly by DELO and its technology partner ASM Assembly Systems, a global manufacturer of SMT placement machines and solutions, show the adhesive’s excellent dispensing properties using—among other dispensing systems—the "Glue Feeder." This jet valve allows the adhesive to be dispensed contactlessly and in any direction, including from upside down. The adhesive is applied directly to the component, not the printed circuit board. This is one solution that ensures fast and highly precise processes. Depending on the dispensing equipment used, drop sizes of 250 µm or lower can be achieved. Even after shooting several dots, the jet valve keeps dispensing patterns uniform, not showing any typically unwanted side effects such as satellite droplets.
The use of DELO MONOPOX EG2596 for the die attach process illustrated with adhesive dots.
Want to know if DELO MONOPOX EG2596 can fit into your application? Contact us to take advantage of our commitment-free project consulting.
DELO is a leading provider of high-tech adhesives. For over 25 years, we have offered solutions for the automotive, electronics, and semiconductor industries. Our innovative technologies set industry standards. Companies like Bosch, Huawei, and Siemens rely on DELO for superior adhesive technologies.
We are your touchpoint for high-tech bonding. Our specialist worldwide are keen to support you. Get in touch with us now!
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