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DELO has developed an electronic adhesive that is both thermally conductive and electrically insulating and shows good strength even after standardized humidity tests with reflow cycles. DELO MONOPOX TC2270 ensures fast heat transfer and exceptional reliability in semiconductors in power electronics.
A common reason for power semiconductor failure is heat which develops in very small components with no efficient form of heat dissipation available. Adhesives not only ensure a permanent bond, but also dissipate heat and provide electrical insulation.
DELO MONOPOX TC2270 is a one-component, heat-curing epoxy resin engineered for use in power semiconductor applications. Due to its ceramic filler, comprised of aluminum nitride, it provides very high thermal conductivity at 1.7 W/(m∙K) (measured according to ASTM D5470 criteria). This is comparable to silver-filled isotropic conductive adhesives (ICA).
One benefit of DELO MONOPOX over ICA is that it is also electrically insulating on top of ensuring reliable heat dissipation. Using the new electronic adhesive additionally allows proportionate component costs to be reduced.
The image illustrates the use of adhesive (depicted in pink) in the assembly of a microchip on a green circuit board, as well as in mounting the board itself onto a gray heat sink.
Once cured, DELO MONOPOX TC2270 has a compression shear strength of 34 MPa on FR4 composite material and of 11 MPa on high-performance LCP plastics. When bonding microchips, the electronic adhesive reaches values of 60 N in the die shear test (1x1 mm² silicon dies on gold surface). Even after standardized humidity tests, DELO MONOPOX TC2270 shows good strength. To determine the moisture sensitivity level (MSL 1), silicon dies were bonded to different PCB materials, stored for one week at 85 °C and 85% air humidity, and then subjected to three consecutive reflow cycles. Even with these loads, the adhesive retained its high strength.
To enable the bonding of temperature-sensitive assemblies and prevent damage caused by excess temperature, the adhesive has been chemically engineered to ensure that final strength is reached after 90 minutes at a curing temperature of 60 °C. With a temperature of 80 °C, the curing process can be reduced to 15 minutes. In this way, production processes can be individually adapted to the component types and quantities to be manufactured. The adhesive's service temperature range is between -40 and +150 °C.
DELO MONOPOX is thermally conductive and electrically insulating at the same time.
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DELO is a leading provider of high-tech adhesives. For over 25 years, we have offered solutions for the automotive, electronics, and semiconductor industries. Our innovative technologies set industry standards. Companies like Bosch, Huawei, and Siemens rely on DELO for superior adhesive technologies.
We are your touchpoint for high-tech bonding. Our specialist worldwide are keen to support you. Get in touch with us now!
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![[Translate to German:] Monolithic wafer with functional structures made of DELO DUALBOND IC343 combined with nanostructures made of DELO KATIOBOND OM614](/fileadmin/_processed_/d/b/csm_Micro-optics_monolithic-lenses_lightstage_content-716x477_9b915966d1.webp)
![[Translate to German:] Close-up image of a circuit board with a grid of bright blue LED lights arranged in a square pattern, showcasing microelectronic technology with vibrant illumination against a dark background.](/fileadmin/_processed_/1/d/csm_news_401407_micro-led-board_content_a9336f654a.webp "[Translate to German:]")
