Adhesives exhibit optimum efficiency when they save both energy and time. DELO’s low temperature-curing adhesives do just that, doing so in very little time.
Different curing methods have their limitations. For example, while curing via pure light is effective in most cases, it is not a feasible solution to curing shadowed areas. While pre-activation is a possible solution here, in optical applications where active alignment processes are present, this method is not fast enough. In dual-curing applications, light and humidity can sometimes not be strong enough mechanisms or have other limitations with regard to yellowing or outgassing. In the case of all these limitations, low-temperature curing in addition to initial light fixation is a good workaround.
Their low curing temperature prevents damage high temperatures may otherwise cause temperature-sensitive substrates. It also reduces thermal stress between materials, thus limiting stress on the component itself.
For some low temperature-curing DELO MONOPOX adhesives, final strength can take place in just one 30-minute process step at 60 °C. This makes them the fastest of their kind while still able to maintain their favorable properties. Some of these properties include good adhesion to plastics like LCP, PA, and PPS, their strength and flexibility, as well as low shrinkage, outgassing, and yellowing.
In addition to the MONOPOX family, DELO offers a wide variety of DELO DUALBOND adhesives that reach full strength at only +60 °C after prefixation by light. These adhesives are mainly used in electronics.
Dual-curing adhesives can be prefixed after only 0.5 seconds of exposure to light. Prefixation is particularly advantageous in production lines since the component will be directly transferred to the next process step. This guarantees reproducibility and high throughput, avoiding incidents like slippage with individual components. The DELO DUALBOND family of products also features excellent adhesion to LCP and are supremely flexible (elongation at tear up to 70 %).
What our low temperature-curing adhesives can currently achieve is certainly no easy feat. However, that should not mean we should stop there. With DELO’s mission to constantly innovate, developments are underway to achieve heat curing at temperatures below even 60 °C. Thus, keep an eye out for future products that will take production efficiency and yield quality a step further.
Are you looking for low-temperature curing adhesives for your application? Let our experts advise you on possible solutions without obligation.
DELO is a leading provider of high-tech adhesives, offering solutions for automotive, electronics, and semiconductor industries for over 25 years. Our innovative technologies set industry standards. Companies like Bosch, Huawei, and Siemens trust DELO for superior adhesive technologies.