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SLT adhesives from the DELO DUALBOND LT family enable super low temperature curing as of 45°C
In consumer electronics assembly, conventional heat-curing processes often demand temperatures of 80°C or curing times of 90–120 minutes at 60°C. This strains sensitive components—and slows production down.
DELO's new generation of super low temperature (SLT) curing adhesives enables reliable bonding at temperatures as low as 45°C. This is significantly below conventional processes. The products are part of the DUALBOND LT family. Concrete customer projects prove that they achieve measurable productivity increases and reduce costs as well as emissions.
SLT Adhesives
Traditional heat-curing steps create real challenges on the assembly line. High temperatures risk damaging heat-sensitive components and restrict which materials can be used. Batch ovens slow down production and limit flexibility in assembly sequences. That is why DELO continues to push its research and development further in the direction of super low temperature curing.
DELO's SLT adhesives directly address these limitations. Curing at 60°C in just 10 minutes makes inline heat tunnels a viable alternative to batch ovens. But it gets even cooler: At 45°C, simulation data confirms a clear, quantitative reduction in component deformation—translating into improved optical stability and long-term reliability confirmed in temperature shock tests.
Lower curing temperatures don't just protect components—they open up new possibilities:
This expands both material compatibility and the range of feasible assembly sequences.
The SLT range is designed to match different production requirements—from the fastest possible cure at moderate temperatures to minimal thermal stress.
Options are available that closely match the mechanical properties of established very low temperature curing (VLT) adhesives, making integration into existing processes straightforward.
DELO's SLT adhesives follow the proven dual-curing approach. A brief UV or visible light exposure locks components in place within seconds. The subsequent low-temperature curing step then delivers full mechanical strength and long-term reliability—combining speed, precision, and protection in a single process.
The adhesives achieve full curing at 60°C after 10 minutes. At 45°C, either 60 minutes are sufficient for complete curing, or 20 minutes of pre-activation, after which full curing occurs within 24 hours at room temperature.
Schematic illustration of a camera module: blue arrows symbolize the low-temperature curing process of new SLT adhesives (figure: DELO)
DELO's SLT adhesives set a new benchmark for low temperature curing in consumer electronics assembly. By curing reliably at temperatures as low as 45°C, they protect sensitive components, enable new materials and assembly sequences, and deliver up to 2.5 times higher productivity. As part of the DUALBOND LT family, they combine the speed of light fixation with the strength of low-temperature curing—in a single, streamlined process. For manufacturers facing the dual challenge of throughput and component protection, SLT adhesives deliver a clear answer.
Would you like to find out how DELO's SLT adhesives can optimize your assembly process? Our experts are ready to help.
DELO will present its SLT adhesives at the China International Optoelectronic Expo (CIOE), September 9–11, 2026, at the Shenzhen World Exhibition & Convention Center (hall 1, booth 1D81). The presentation also covers DELO's consumer camera, optics and photonics, and co-packaged optics portfolio.
DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.
