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Meet us at the
Asia’s leading optoelectronics exhibition
Discover our latest adhesive innovations—designed for the future of optoelectronics.
Dive into our latest developments in Consumer Camera, Augmented Reality and CPO & PIC.
🗓 September 9-11, 2026
# Hall 1, Booth 1D81
⚐ Shenzhen, China
Consumer Camera
Precision meets Perfection
Adhesives for over 30 bonding tasks—from first lens bonding to prism attach
As compact camera modules (CCMs) become more complex, you face increasing demands for speed, performance, and space efficiency. Our high-tech adhesives are designed to meet exactly these needs – from miniaturized assemblies for main cameras to periscope cameras. For all relevant bonding tasks we offer well-established solutions, including the DELO DUALBOND LT product family for fast fixing of components like prisms, low temperature curing, reproducible shrinkage, and low outgassing.
What makes our adhesives your top choice:
Product innovation
Low Temperature Curing Adhesives
Benefits of bonding from +45°C:
Highest precision at scale
Periscope camera bonding
A multitude of serial-ready bonding solutions:
Learn more about our 30+ bonding solutions
Augmented Reality
Performance at Every Wavelength
Full range portfolio from crystal-clear to highly opaque formulations
High-quality AR glasses rely on a precise interplay of optical components—and the right adhesive for every specific application makes all the difference. Achieving compact designs and excellent image quality demands materials that perform at the highest level: from ultra-thin, index-matched bonding of reflective waveguides to high optical density solutions for edge blackening. With our portfolio of high-tech adhesives, we cover all critical steps—including innovative solvent-free and UV-curable options.
What makes our adhesives your top choice:
Tailored to Your Optics
Adhesives for AR Waveguides
Benefits of index-matched bonding:
Enabling series production
AR Edge blackening adhesive
Benefits of high optical density bonding (up to OD3):
Learn more about our full range solutions for AR glasses
PIC & CPO
Optical Interconnects at Scale
Advanced adhesives for future-ready optical communication
Photonic integrated circuits (PIC) and co-packaged optics (CPO) push the boundaries of data processing—even the slightest misalignment or shrinkage in the light path can compromise performance. Our dual-curing optical adhesive DELO DUALBOND OB6268 is engineered for exactly these challenges, combining fast UV-fixation with outstanding mechanical reliability for the right adhesive for every specific application in PIC and CPO assemblies.
What makes our adhesives your top choice:
Brandnew adhesive
Optical coupling adhesive
Benefits of our new optical alignment adhesive:
Ready for high-volume manufacturing
CPO assembly
A multitude of serial-ready bonding solutions:
Learn more about our advanced adhesives for future-ready optical communication
Devices
Our advanced equipment takes your optoelectronic production to the next level
Explore next‑generation equipment that redefines precision, speed, and reliability in optoelectronic manufacturing. At CIOE 2026, you’ll see how intelligent dispensing systems, advanced UV curing lamps, and compact automation solutions work together. Get faster production and higher quality results right on your production floor.
Registration
Schedule your personal consultation and discover the right adhesive solution for your application.
Tell us your preferred day and topics of interest – we’ll get back to you with the right expert and a suitable time slot.
DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.
