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DELO organizes Virtual Semicon Conference

The Semicon Meets Sustainability virtual conference, organized by DELO, will take place on November 5, 2024 from 8:00 to 10:15 a.m. (CET) and in a condensed format from 5:00 to 6:40 p.m. (CET). Experts from the adhesive manufacturer as well as renowned industry experts will discuss new developments

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DELO proves feasibility of adhesives as soldering alternatives for miniLEDs, predicting future microLED integration

DELO has conducted in-house feasibility studies, electrically and mechanically connecting miniLED dice using directional conductive adhesives. The results show reliable bonding strength and high yields during on-light testing. With these findings, it is evident that adhesives refine miniLED display

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DELO introduces new microelectronics adhesive for ultra-fine structures

DELO has developed a new adhesive that can be used to create  ultra-fine structures within seconds. DELO DUALBOND EG4797 thus creates new possibilities in heterogeneous integration and optical packaging applications. Able to realize unlimited freeform structures and razor-thin optical barriers, the

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Matthias Stollberg

+49 8193 9900 - 212

press@DELO-adhesives.com

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