Sealing compounds are used to protect electronic components from high temperatures or petrol and oil. Epoxy resins such as DELO-DUOPOX CR8031 are very resistant and developed for fast production.

The two-component epoxy resin shows good adhesion to various plastics such as PA or ABS. Even with PE, a compression shear strength of 20 MPa was reached after plasma pretreatment, although this cheap and resistant plastics is difficult to bond due to its low surface energy.

 With an elongation at tear of 5 %, DELO-DUOPOX CR8031 is tough-hard and withstands permanent temperatures of up to 180 °C. Even after 1000 hours of storage at maximum temperature of use, or at 85 °C and 85 % air humidity, the product's mechanical properties remain unchanged. Furthermore, it is resistant to oil and fuel, a property that makes it suitable for applications in the engine compartment – for example for potting of sensors and printed circuit boards or for sealing of housings.

The epoxy resin achieves this reliability without any fillers, thus providing many benefits in terms of processing. Since there is no risk of filler sedimentation, no stirring of the potting compound is required and, consequently, no degassing either, which results in a simpler system design. Additionally, this low-viscous product exhibits very good flow behavior.

DELO-DUOPOX CR8031 is mixed in a 2:1 ratio. Not only can it be used for fully automatic production, but it is also well suited for semi-automatic processes in medium production volumes. Dispensing guns with their static mixing tubes allow the resin to be applied virtually like a one-component adhesive. The epoxy resin has been optimized for fast production and can be heat-cured within 10 minutes at 80 °C. Without additional heating, it reaches its functional strength after 16 hours of curing at room temperature, thus saving energy and minimizing stress on the component.