Free Ticket: SEMICON Europa 2025

Discover the Future of Adhesives & Devices for Electronics Manufacturing

November 18–21, 2025 | Messe Munich | Hall C1, Booth C1755

Get your free ticket and explore high‑performance adhesive and process solutions for semiconductors and microelectronics.

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Devices

Innovations You Can Experience Live

See how advanced devices and equipment take semiconductor production to the next level

Explore next‑generation devices and equipment that redefine precision, speed, and reliability in semiconductor manufacturing. At SEMICON Europa 2025, you’ll see how intelligent dispensing systems, advanced UV curing lamps, and compact automation solutions work together – enabling faster production and higher quality results right on your production floor.

Adhesives & Process Technologies

Experience Smart Solutions for Every Semiconductor Challenge

Find solutions that perfectly match your application – from wafer‑ to package‑level

At SEMICON Europa 2025, you discover adhesive and process technologies designed to make electronic components stronger, production faster, and results more reliable.

Everything you see is engineered to help you achieve maximum efficiency, reliability, and sustainability in semiconductor production.

Semiconductor Packaging

Reinforcement

Improve die attach reliability and flip-chip processes with specialized adhesives and conductive materials by DELO.

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Semiconductor Packaging

Cap Bonding & Lid Attach

DELO provides adhesives for cap bonding and lid attach, ensuring secure attachment of heatspreaders and filter glasses despite expansion and pressure challenges.

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Optics & Photonics

Optical Communication (PIC)

Zur Minimierung von Verlusten zwischen elektrischen und optischen Komponenten in integrierten optischen Schaltkreisen kommen DELO Klebstoffe zum Einsatz.

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Semiconductor Packaging

Encapsulation

DELO provides a wide range of potting compounds for semiconductor encapsulation, featuring tension-equalizing to high-strength properties and precise flow limits.

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Heterogeneous Integration

Micro Dam

High thixotropy adhesives from DELO deliver precise microstructures and optical packaging on circuit boards.

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Sustainability

Shaping a Sustainable Future

Efficient Technologies That Drive Sustainability

Discover at SEMICON Europa 2025 how advanced process equipment merges performance with environmental responsibility.

For example Activation on the Flow combines precise dispensing and preactivation in one compact unit. It fits seamlessly into existing lines or operates as a stand‑alone system — saving space and simplifying integration.

By dispensing and curing at the same time, the system cuts energy use and CO₂ emissions by up to 98 %, enabling faster cycles and more sustainable semiconductor production.

Look forward to a new product line featuring even smaller and more compact devices that enable significantly easier integration into existing systems — while achieving ever higher dispensing precision. More information coming soon.

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Activation on the flow Design freedom Energy savings

System Solutions

DELO-ACTIVIS 600

Volumetric dispenser with integrated UV curing lamps for light-curing adhesives

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Registration

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About DELO

DELO is a leading provider of high-tech adhesives and has been offering solutions for the semiconductor, automotive, and electronics industries for over 25 years. Our innovative technologies set industry standards. Companies such as Bosch, Huawei, and Siemens trust DELO when it comes to superior adhesive technologies.

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Industry Leaders Trust DELO